česky english December 02, 2023



Sensors in electronics manufacturing


Billion-dollar market for industrial sensors through digitalization Sensor technology in almost all manufacturing processes Smart manufacturing sensor technology live at productronica Sensors are the key technology used by smart systems...

17.10. 2023 | News

Benchmark Power Density of 5130 W/in3 with GaN FETs Powers Artificial Intelligence and Advanced Computing Applications


EPC announces the availability of the EPC9159, a 48 V / 12 V, LLC converter designed for high-density 48 V server power and DC-DC converters. This reference design can deliver 1 kW of power in a tiny 17.5 mm x 22.8 mm footprint for a power density...

16.10. 2023 | News

Mouser Inspires Innovation For All at Maker Faire Rome 2023


Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, will be exhibiting at Maker Faire Rome - the European Edition 2023 in Fiera di...

14.10. 2023 | News

TDK offers new ultra-compact snap-in capacitor series with extremely high capacitance density


TDK Corporation presents the new EPCOS B43657* aluminum electrolytic capacitor series with snap-in terminals. The capacitors achieve a service life of at least 2000 h at a maximum operating temperature of 105 °C and cover a rated voltage range...

13.10. 2023 | News

Yokogawa Test & Measurement Releases DLM5000HD Series High Definition Oscilloscopes


Yokogawa Test & Measurement Corporation announces the release of the DLM5000HD series high definition oscilloscopes. Positioned as a high-performance version of the DLM5000 series, the DLM5000HD series expands Yokogawa’s oscilloscope lineup...

12.10. 2023 | News

Indium Corporation Recognized by Electronics Maker for Best Soldering Product of the Year


Indium Corporation was recently the proud recipient of Electronics Maker’s prestigious Best of Industry Award 2023 for Best Soldering Product of the Year. The award was received for Indium Corporation’s InFORMS® reinforced solder preforms. The...

11.10. 2023 | News

Teledyne e2v Develops Space Computing Reference Design featuring Microchip’s Radiation-Tolerant Gigabit Ethernet PHYs


Teledyne e2v is developing, in collaboration with Microchip Technology, a ground-breaking space computing reference design to enable high-speed data routing in Space applications. This innovative reference design will be presented at EDHPC 2023...

10.10. 2023 | News

Spark Connected and Infineon Technologies unveil 500 W wireless charging module


Spark Connected and Infineon Technologies are announcing the market release of a 500 W wireless charging solution named Yeti. The ready-to-integrate wireless charging module is intended for the powering and charging of industrial machinery,...

09.10. 2023 | News

NeoCortec releases new NeoMesh protocol stack version 1.6 firmware


NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has released an updated NeoMesh protocol stack version 1.6 firmware for its NC2400 and NC1000 module series to support new Sensirion SHT4xA temperature &...

07.10. 2023 | News

Nexperia expands portfolio to include first integrated 5 V load switch


Nexperia announces the expansion of its analog and logic product portfolio with the introduction of the load switch product family. Headlining the release is the NPS4053, a high density Integrated Circuit (IC) designed to provide a smaller...

06.10. 2023 | News