Microchip Unveils New High-Density Power Module for AI at the Edge Applications

AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications. Microchip Technology announces the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I²C and PMBus^® interfaces.

The MCPF1412 power module is designed to deliver superior performance and reliability, ensuring efficient power conversion and reduced energy loss. Its compact form factor of 5.8 mm × 4.9 mm × 1.6 mm and innovative Land Grid Array package significantly reduce the required board space by over 40% compared to traditional discrete solutions. This reduction in size, coupled with enhanced reliability and minimized PCB switching and RF noise, positions the MCPF1412 as a leading industry device.

The MCPF1412M06 is a versatile device that offers significant flexibility for configuration and system monitoring through the I²C and PMBus interfaces. Additionally, it supports standalone operation without a digital interface, allowing designers to easily configure output voltages using simple resistor divider adjustments and monitor the system via the Power Good output (more info).