Articles

Texas Instruments (TI) introduced new integrated automotive chips to enable safer, more immersive driving experiences at any vehicle price point. TI's AWRL6844 60GHz mmWave radar sensor [1] supports occupancy monitoring for seat belt reminder...

Mouser Electronics, Inc. announced a new eBook in collaboration with Analog Devices, Inc. (ADI) and Bourns exploring the challenges and benefits of Gallium Nitride (GaN) technology in the pursuit of efficiency, performance, and sustainability....

THT (Through-Hole Technology)-based electronic assemblies with nickel or brass pins can be used in various applications and environments. This applies in particular to areas with demanding environmental conditions, where the electrical and...

Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. This advanced PMIC line combines superior performance, cost-efficiency, and versatility, setting a new standard in sustainable design for low...

Siglent released the SDG1000X Plus series function/arbitrary waveform generator, providing engineers with a more flexible and efficient signal generation solution. This series offers a maximum output frequency of 60 MHz, 16-bit vertical...

Murata Manufacturing Co. Ltd announced the development of the world’s smallest class 006003-inch size (0.16 mm x 0.08 mm) chip inductor. This achievement represents a volume reduction of approximately 75% compared to the smallest 008004-inch size...

Software and artificial intelligence (AI) are already shaping our present. For the future, however, they will be crucial. Bosch was quick to recognize the opportunities offered by intelligent software and services, and focused on them at an...

Picture.: 300-mm-Tools at CNT (© Fraunhofer IPMS) Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective. The...

Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a...

Siemens Digital Industries Software announced the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™...