September 10, 2026 
Professional magazine and portal dedicated to electronics News
Essential Performance and Real-time Control Without the Baggage
Designers of real-time control applications are increasingly challenged to balance performance and peripheral integration while keeping system cost and complexity low. To address these challenges, Microchip Technology has introduced the dsPIC33CK...
Infineon extends XENSIV™ magnetic sensing portfolio with high-performance TMR technology
Infineon Technologies expands its proven XENSIV™ magnetic sensing portfolio with a comprehensive range of Tunnel Magnetoresistance (TMR) sensors. Complementing the company's established Hall, GMR and AMR sensing solutions, the new TMR technology...
STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications
New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The 700V PowerGaN devices in the STPOWER portfolio...
1-bit and 2-bit dual-supply bus transceivers from Toshiba support low-voltage level shifting
Toshiba expands its 74AVC series lineup of dual-supply bus transceivers with four new 1-bit products, 74AVC1T45NX, 74AVCH1T45NX, 74AVC1T45FU, and 74AVCH1T45FU, and two new 2-bit products, 74AVC2T45FK and 74AVCH2T45FK. The products can be used for...
UNI-T Launches New 12-Bit Rack-Mount Oscilloscope for High-Density System Integration
As automated test systems become more compact and signal environments become more complex, engineers need oscilloscopes that deliver high channel density, accurate signal acquisition, and seamless system integration—without taking up valuable rack...
GDS-2000HD/HG: precise, compact, and intelligent - meeting the needs of every application scenario
Laboratories demand high precision—often at the expense of size and cost. Field applications require lightweight portability—typically sacrificing accuracy. Educational environments, tasked with delivering correct measurement concepts, must often...
TDK expands micro POL power module portfolio for high-density AI edge systems
TDK Corporation announced the FS3303, the first member of a major expansion of its micro POL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs. Despite its small...
EPC and Mouser Electronics Announce Global Distribution Deal
Efficient Power Conversion (EPC), the world’s leader in enhancement-mode gallium nitride (eGaN®)-based power management solutions, offering GaN devices spanning 15V to 350V, announced a global distribution agreement with Mouser Electronics, Inc.,...
Infineon CoolGaN™ BDS 40V G3 family delivers up to 82 percent footprint reduction for portable power designs
Infineon Technologies expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For...
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as...