česky english October 01, 2026

News

RSS

Tektronix Unifies Power and Signal Integrity Analysis for Modern Power Distribution Networks

z0105-01.jpg

Tektronix introduced its Power Distribution Network (PDN) Analysis Software for 4 Series B, 5 Series B, and 6 Series B Mixed Signal Oscilloscopes. By combining power integrity and signal integrity validation into a single workflow, the solution...

27.08. 2026 | News

Toshiba introduces compact photorelays for accurate switching in semiconductor test systems

z0104-01.jpg

Toshiba Electronics Europe introduces two photorelays, the TLP3487 and TLP3491, designed for semiconductor test equipment. Housed in a compact P-SON4 package, the devices support a high ON-state current with low OFF-state leakage current to help...

25.08. 2026 | News

TDK introduces HVC 5422C embedded motor controller for silent BLDC applications up to 1A

z0103-01.jpg

TDK Corporation announces the Micronas HVC 5422C, a new automotive-qualified embedded motor controller for BLDC and BDC motors that combines advanced FOC capabilities for smooth, silent motor operation with increased memory resources and software...

20.08. 2026 | News

Vishay Intertechnology TSOP15300 Series IR Receivers Support All Major Remote Control Codes

z0102-01.jpg

Vishay Intertechnology introduced a new series of infrared (IR) receiver modules for IR remote control applications. Featuring a wide modulation frequency acceptance from 30 kHz to 68 kHz, devices in the Vishay Semiconductors TSOP15300 series are...

18.08. 2026 | News

Rohde & Schwarz presents new software for three-phase power analysis on MXO series oscilloscopes

z0101-01.jpg

With the new R&S MXO-K333 3-phase power analysis software option, Rohde & Schwarz brings power analyzer-style insights directly to its MXO series oscilloscopes. Designed for engineers developing and debugging three-phase AC systems, the...

13.08. 2026 | News

Silicon Labs Unveils BG2B, Its Lowest-Power BLE SoC with Industry-Leading Power Efficiency, Security, and Integration

z0100-01.jpg

Silicon Labs announced the BG2B, its next Series 2 Bluetooth® Low Energy (LE) wireless SoC designed to help developers build smaller, more secure, and longer-lasting battery-powered IoT devices by providing the industry's best combination of...

11.08. 2026 | News

ST unveils world’s first ST54M secure mobile chip with post-quantum cryptography for next-generation connected services

z099-01.jpg

STMicroelectronics has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected...

06.08. 2026 | News

Infineon extends SSI portfolio with compact ISSI20BxxF family for industrial automation applications

z098-01.jpg

Infineon Technologies introduces the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and...

04.08. 2026 | News

Sensirion announces global availability of the STC42A Automotive H2 sensor for thermal runaway detection

z097-01.jpg

Sensirion announces the general market availability of the STC42A, the perfect choice for hydrogen detection, both in battery thermal runaway and hydrogen leakage applications. Designed for automotive applications that require reliable hydrogen...

30.07. 2026 | News

Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs

z096-01.jpg

Nexperia announced the release of 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging, extending its growing wide-bandgap (WBG) portfolio with a top-side cooled surface-mount package optimized for high-power density and thermally demanding...

28.07. 2026 | News