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GW Instek GPM-8320-60 / 8330-60 Digital Power Meter

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GW Instek GPM-8320-60/GPM-8330-60 are extension models of the existing three-phase power meter GPM-8320/GPM-8330. The GPM-8320-60 provides 2 input elements, and the GPM-8330-60 provides 3 input elements and the added "-60" symbol means the maximum...

05.06. 2025 | News

STMicroelectronics combines activity tracking and high-impact sensing in miniature AI-enabled sensor for personal electronics and IoT

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STMicroelectronics has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. Devices equipped with this module can allow applications to fully...

02.06. 2025 | News

ROHM Develops New High Power Density SiC Power Modules

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ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and...

30.05. 2025 | News

Compact All-in-One Handheld Signal Analyzer for 5G/LTE Field Testing

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Siglent introduces the SHA860A series, a next-generation handheld signal analyzer designed to revolutionize 5G/LTE field testing. Combining spectrum analysis, vector network analysis, and cable/antenna testing into a single portable platform, the...

29.05. 2025 | News

TI introduces the world's smallest MCU, enabling innovation in the tiniest of applications

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Texas Instruments introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU...

26.05. 2025 | News

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

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Nexperia introduces a range of highly efficient and robust industrial grade 1200 V silicon carbide (SiC) MOSFETs with industry leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This...

23.05. 2025 | News

Advanced InSb Hall Element Sensors from Diodes for Rotation and Current Detection Applications

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Diodes Incorporated (Diodes) introduces its first series of advanced InSb Hall element sensors for rotation speed detection and current measurement in consumer applications such as laptops, mobile phones, joysticks, and in motors found in various...

22.05. 2025 | News

New at Mouser: BeagleBoard CC33 2.4GHz Wi-Fi 6 Bluetooth LE Wireless Modules

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Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi®...

21.05. 2025 | News

Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range

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Renesas Electronics Corporation introduced the RA0E2 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of...

19.05. 2025 | News

Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design

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Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To address these demands, Microchip Technology has released the PIC16F17576...

16.05. 2025 | News