Tektronix introduced its Power Distribution Network (PDN) Analysis Software for 4 Series B, 5 Series B, and 6 Series B Mixed Signal Oscilloscopes. By combining power integrity and signal integrity validation into a single workflow, the solution...
Toshiba Electronics Europe introduces two photorelays, the TLP3487 and TLP3491, designed for semiconductor test equipment. Housed in a compact P-SON4 package, the devices support a high ON-state current with low OFF-state leakage current to help...
TDK Corporation announces the Micronas HVC 5422C, a new automotive-qualified embedded motor controller for BLDC and BDC motors that combines advanced FOC capabilities for smooth, silent motor operation with increased memory resources and software...
Vishay Intertechnology introduced a new series of infrared (IR) receiver modules for IR remote control applications. Featuring a wide modulation frequency acceptance from 30 kHz to 68 kHz, devices in the Vishay Semiconductors TSOP15300 series are...
With the new R&S MXO-K333 3-phase power analysis software option, Rohde & Schwarz brings power analyzer-style insights directly to its MXO series oscilloscopes. Designed for engineers developing and debugging three-phase AC systems, the...
Silicon Labs announced the BG2B, its next Series 2 Bluetooth® Low Energy (LE) wireless SoC designed to help developers build smaller, more secure, and longer-lasting battery-powered IoT devices by providing the industry's best combination of...
STMicroelectronics has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected...
Infineon Technologies introduces the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and...
Sensirion announces the general market availability of the STC42A, the perfect choice for hydrogen detection, both in battery thermal runaway and hydrogen leakage applications. Designed for automotive applications that require reliable hydrogen...
Nexperia announced the release of 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging, extending its growing wide-bandgap (WBG) portfolio with a top-side cooled surface-mount package optimized for high-power density and thermally demanding...