News

Yokogawa Test & Measurement Corporation announces the release of the SL2000 High-Speed Data Acquisition Unit, a ScopeCorder series product with a wide range of data logging functionalities for evaluation and test applications, including...

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, has partnered with Infineon Technologies to provide the engineering community with a new webinar titled “Breaking Voltage...

Infineon Technologies introduces PSOC™ 4100T Plus, an Arm® Cortex®-M0+ microcontroller (MCU) with Multi-Sense. The new microcontroller offers a rich blend of analog and digital capabilities, featuring 128K Flash, 32K SRAM, and Infineon’s...

In the current marketplace, Bill of Material (BOM) costs are continuing to rise and developers must work to optimize performance and budgets. Recognizing that a significant portion of the mid-range FPGA market does not require integrated serial...

GW Instek GPM-8320-60/GPM-8330-60 are extension models of the existing three-phase power meter GPM-8320/GPM-8330. The GPM-8320-60 provides 2 input elements, and the GPM-8330-60 provides 3 input elements and the added "-60" symbol means the maximum...

STMicroelectronics has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. Devices equipped with this module can allow applications to fully...

ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and...

Siglent introduces the SHA860A series, a next-generation handheld signal analyzer designed to revolutionize 5G/LTE field testing. Combining spectrum analysis, vector network analysis, and cable/antenna testing into a single portable platform, the...

Texas Instruments introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU...

Nexperia introduces a range of highly efficient and robust industrial grade 1200 V silicon carbide (SiC) MOSFETs with industry leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This...