News

ON Semiconductor has introduced a new Bluetooth® Low Energy mesh networking solution based on its ultra-low-power RSL10 System-in-Package (RSL10 SIP). Using the RSL10 Mesh Platform, engineers can easily implement ultra-low-power mesh...

The AP9221 is a single chip protection solution specially designed for 1-cell Li+ rechargeable battery pack application. The AP9221 includes a 1-cell Lithium ion battery protection chip and dual N-CH MOSFET with common drain. The AP9221...

FLIR Systems, Inc. announced the availability of the new FLIR Blackfly S visible spectrum camera module, the first to integrate the Sony Pregius S IMX540 sensor with 24.5 MP at 12 FPS in a USB3 camera. The combination of the Blackfly S feature set...

Confidence and commitment brings electronica China to a successful close 1,373 exhibitors and 81,126 visitors Four major technology parks and five technical support forums The introduction of a Resource Integration Technology Park to...

Power Integrations announced an AEC-Q100-qualified version of its LinkSwitch™-TN2 switcher IC for buck or non-isolated flyback applications. Featuring an integrated 750 V MOSFET, the new automotive-qualified LinkSwitch-TN2 IC provides simple...

Reduce power consumption and size while increasing reliability of industrial, healthcare and internet of things (IoT) applications with the MAX32670 low-power Arm® Cortex®-M4 microcontroller (MCU) with floating-point unit from Maxim...

Recognizing new, creative, viable, and above all, sustainable business ideas from the world of additive manufacturing: This year’s Formnext Start-up Challenge once again invites submissions from innovative young companies. New for this year,...

Keysight Technologies has launched a new family of photovoltaic (PV) array simulators that are the first to deliver 2000 V and 20 kW of power in a 3U format, enabling engineers to maximize solar power conversion. To keep solar power at grid...

Farnell, the Development Distributor, has launched a charitable initiative with support from supplier partners Rohde & Schwarz, ROHM and Multicomp Pro, seeking to ‘Make a Better Tomorrow Together’. Visitors to the Farnell...

The program of the SMTconnect goes digital, which takes place from 28 – 29 July 2020, is now almost complete. Well-known representatives from the industry, including the VDMA, ZVEI and the Fraunhofer IZM, will be on board. In addition to the...

Accelerating the creation of LED streetlamps and other medium- to high-power lighting applications, the STMicroelectronics EVL150W-HVSL LED-driver evaluation board and reference design integrates features that ensure high performance and save...

Efficient Power Conversion (EPC) Corporation and VPT, Inc., a HEICO company, announce the establishment of EPC Space LLC, a joint venture focused on designing and manufacturing radiation hardened (Rad Hard) GaN-on-silicon transistors and ICs...