REAL3 ToF image sensor: fourth generation with HVGA resolution


Infineon Technologies is presenting the fourth generation of its REAL3™ image sensor IRS2771C. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular,...

24.06. 2019 | News

Dialog Launches Family of Audio Codecs Delivering Groundbreaking ANC


Dialog Semiconductor announced the DA740x, a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation (ANC), providing optimal audio performance in any environment to the rapidly-growing wireless...

21.06. 2019 | News

Flir Announces TrafiData Intelligent Thermal Traffic Sensor Solution


Flir Systems announced the TrafiData intelligent thermal traffic sensor solution for improved data collection capabilities to offer transportation management with key insights for smarter, safer cities. Flir TrafiData is a unique offering in the...

20.06. 2019 | News

NXP Sets a New Efficiency Benchmark for RF Energy


NXP Semiconductors announced the first RF power transistor designed for RF energy using Gallium Nitride on Silicon-Carbide (GaN-on-SiC). Leveraging the high efficiency of GaN, the MRF24G300HS exceeds the efficiency of most magnetrons at 2.45 GHz,...

17.06. 2019 | News

Voltage Level Translator Provides Direction-Free Flexibility


Diodes Incorporated announced a new addition to its family of low voltage level translators, offering simple and autonomous bidirectional operation. The PI4GTL2002 is a 2-bit level shifter designed to translate signals conditioned for one voltage...

14.06. 2019 | News

Tektronix Launches New 3 Series MDO and 4 Series MSO


Tektronix introduced two new products to its portfolio with the launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal Oscilloscope (MSO). Built on the award-winning user experience first introduced in the 5 and 6 Series...

13.06. 2019 | News

SMTconnect 2019: movie time


SMTconnect, formerly known as SMT Hybrid Packaging, is the only event in Europe that brings together people and technologies from the areas of development, production, services, and applications in connection with electronic assemblies and...

11.06. 2019 | News

First Sensirion Miniaturized CO2 Sensor


Sensirion is announcing the SCD40 – the first miniaturized CO2 and RH/T sensor that fits in a space of just one cubic centimeter. This disruptive innovation is based on the photoacoustic sensing principle and combines minimal size with...

10.06. 2019 | News

The purmundus challenge 2019 takes additive manufacturing to the next dimension


‘Beyond 3D printing’ is the theme of this year’s purmundus challenge, the ideas competition for imaginative, aesthetic and trend-setting product ideas and innovative projects. Once again in 2019, the competition will serve as the...

08.06. 2019 | News

Vishay Optocouplers in Space-Saving DIP-4 and SMD-4 Packages Offer 800 V Off-State Voltage


Vishay Intertechnology, Inc. broadened its optoelectronics portfolio with the release of two new series of optocouplers with phototriac output in space-saving compact DIP-4 and SMD-4 packages. Featuring a high off‑state voltage of 800 V and...

07.06. 2019 | News

The new Fluke ii900 Sonic Industrial Imager pinpoints compressed air leaks in minutes


According to the Compressed Air and Gas Institute (CAGI), the average compressed air system loses 30 percent of its air through leaks but locating those leaks has been a time-consuming and tedious process. The new Fluke™ ii900 Sonic...

06.06. 2019 | News

Latest LED Driver Family Eliminates PWM Audible Noise


Allegro MicroSystems announced the A8060x family, their latest generation of advanced LED backlight drivers. The device family is designed with an innovative and patented Pre-Emptive Boost (PEB) control, eliminating noise that is typically...

03.06. 2019 | News

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