December 22, 2024 
Professional magazine and portal dedicated to electronics 
TDK Corporation has extended the automotive-grade CA series of its MEGACAP MLCCs with a metal frame. Mass production of the product series began in September 2024. In recent years, the development of automobiles with electric powertrains, such...
Renesas Electronics introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and...
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, has partnered with Analog Devices, Inc. (ADI) to offer the engineering community a...
In just a few weeks, the world's leading trade fair electronica, together with SEMICON Europa, will open its doors in Munich. From November 12 to 15, more than 3,000 exhibitors from all over the world will be presenting their latest products and...
Infineon Technologies is introduced its new StrongIRFET™ 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment. Optimized for high robustness and...
ams OSRAM has revealed the TMF8806 next-generation single-zone direct Time-of-Flight (dToF) sensor module for obstacle detection and collision avoidance in home and industrial robotics applications. The new sensor extends ams OSRAM’s dToF...
Teledyne LeCroy announces the Frontline X500e wireless protocol analyzer with Wi-Fi 7. Building upon the success of its predecessor, the Frontline X500, the X500e is a comprehensive one-box solution that seamlessly captures and correlates data...
element14, an Avnet Community, and Arduino, a global leader in open-source hardware and software, have announced an upcoming webinar on enhancing IIoT PLC platforms using the Arduino Opta. This event will explore how to scale industrial projects...
Frankfurt am Main, 26 September 2024. While Germany’s own economic situation remains middling and plenty of global challenges persist, Formnext is poised to write the next chapter in its ongoing success story in 2024. As of late September, 820...
Texas Instruments introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to...
