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Industry’s first radiation-hardened-by-design 512 Mbit QML-qualified NOR Flash for space industry applications

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Infineon Technologies AG announced the industry’s first radiation-hardened-by-design 512 Mbit QSPI NOR Flash memory for space and extreme environment applications. The new device offers a fast quad serial peripheral interface (133 MHz) and the...

Extending artificial intelligence assistance in automatic optical inspection

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Artificial Intelligence (AI) is renowned for image recognition and classification skills, suggesting a great fit with the objectives of AOI. How is the technology being applied and how is performance improving? AI in AOI Equipment suppliers...

TDK launches the industry's smallest thin-film power inductors

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TDK Corporation announced the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices. Mass production of these new components began in December 2024. Increasing...

New GRS200 with extended troubleshooting for the repair of electronic assemblies

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The new GRS200 fault locator uses the proven passive analogue signature analysis and compares a faultless assembly with the board under test. This method detects typical faults in electronics production, service and repairs quickly and without...

New Adapter Board RAB5 from Rutronik System Solutions for LED applications in the automotive industry and Industry 4.0

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The Rutronik Elektronische Bauelemente GmbH presents the new Rutronik System Solutions Adapter Board RAB5. The development board was specifically designed for LED applications in the automotive industry and Industry 4.0. With the Adapter Board...

Keysight introduces portable 800GE benchtop system to test artificial intelligence and data center interconnects

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The Interconnect and network performance tester 800GE benchtop is a quiet, portable, and energy efficient platform. Keysight Technologies, Inc. introduces the Interconnect and network performance tester 800GE benchtop, a new multiport,...

Smart Living at LOPEC 2025: Printed electronics for digitalization

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LOPEC, the trade fair and conference for flexible, organic and printed electronics, will be opening its doors again in Munich from February 25 to 27, 2025. Under the focus topic of Smart Living, companies, research institutes and experts will...

Innovative biosensing technology enables next-generation wearables for individual healthcare and fitness

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new bio-sensing chip for the next generations of healthcare wearables like smart watches, sports bands, connected...

All-in-one solution for powder material evaluation of solid-state batteries and dry processes in a glove box environment

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Hioki E.E. Corporation announced the launch of its powder impedance measurement system, designed for the electric vehicle (EV) solid-state battery R&D market. This system significantly enhances the safety and cost-efficiency of material...

The new XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings

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In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimize energy...