česky english June 12, 2025

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GaN industry matures delivering full technology platform

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The maturation of gallium nitride (GaN) is well underway. GaN has scaled up with the charger market which needed the power and efficiency benefits GaN offers to deliver on the promise of USB-PD. Now the industry is shipping millions of parts...

New edge AI-enabled radar sensor and automotive audio processors from TI empower automakers to reimagine in-cabin experiences

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Texas Instruments (TI) introduced new integrated automotive chips to enable safer, more immersive driving experiences at any vehicle price point. TI's AWRL6844 60GHz mmWave radar sensor [1] supports occupancy monitoring for seat belt reminder...

Explore the benefits of GaN-based power electronics in the new eBook

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Mouser Electronics, Inc. announced a new eBook in collaboration with Analog Devices, Inc. (ADI) and Bourns exploring the challenges and benefits of Gallium Nitride (GaN) technology in the pursuit of efficiency, performance, and sustainability....

Flux pastes for efficient soldering of nickel and brass pins

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THT (Through-Hole Technology)-based electronic assemblies with nickel or brass pins can be used in various applications and environments. This applies in particular to areas with demanding environmental conditions, where the electrical and...

Nexperia enhances energy harvesting portfolio with innovative PMIC reducing BOM cost

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Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. This advanced PMIC line combines superior performance, cost-efficiency, and versatility, setting a new standard in sustainable design for low...

New function/arbitrary waveform generator SDG1000X Plus

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Siglent released the SDG1000X Plus series function/arbitrary waveform generator, providing engineers with a more flexible and efficient signal generation solution. This series offers a maximum output frequency of 60 MHz, 16-bit vertical...

World’s smallest class 006003 size (0.16 mm x 0.08 mm) chip inductor

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Murata Manufacturing Co. Ltd announced the development of the world’s smallest class 006003-inch size (0.16 mm x 0.08 mm) chip inductor. This achievement represents a volume reduction of approximately 75% compared to the smallest 008004-inch size...

Bosch uses software and AI to make its products smarter and make people’s lives safer

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Software and artificial intelligence (AI) are already shaping our present. For the future, however, they will be crucial. Bosch was quick to recognize the opportunities offered by intelligent software and services, and focused on them at an...

Research for the future, application transfer for the present

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Picture.: 300-mm-Tools at CNT (© Fraunhofer IPMS) Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective. The...

Tresky offers a wide range of application options for ultrasonic DIE bonding

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Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a...