Articles

Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a...

Siemens Digital Industries Software announced the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™...

RZ/T2H MPU is ideal for industrial robots, PLCs, and motion controllers thanks to high-performance application processing and fast real-time control. Renesas Electronics Corporation launched the RZ/T2H, the highest performance microprocessor...

The NEX30606 is a high-efficiency, high-accuracy step-down converter that offers a choice of 16 resistor-settable output voltages from input voltages ranging from 1.8 V to 5.0 V. It can deliver up to 600 mA of output current and offers...

Murata Manufacturing Co., Ltd is expanding its innovative wireless communication module lineup by introducing the new Type 2FR/2FP and Type 2KL/2LL modules. Designed to support the next generation of wireless connectivity across smart home,...

New DLP® controller is 90% smaller than the previous generation, enabling compact design for consumer applications, such as lifestyle projectors, gaming projectors and augmented reality glasses. Texas Instruments (TI) introduced a new display...

Yokogawa Test & Measurement Corporation announces the release of the DLM3000HD series of compact, high-definition oscilloscopes. Positioned as a high-performance version of the DLM3000 series, the DLM3000HD series expands Yokogawa’s...

NXP Semiconductors announced the i.MX 94 family, the newest addition to its i.MX 9 series of applications processors, designed for industrial control, programmable logic controllers, telematics, industrial and automotive gateways, and building and...

Murata Manufacturing Co., Ltd revealed an innovative new Stretchable Printed Circuit (SPC) technology marking a significant development in printed circuit technology. Murata's SPC represents the next advancement in substrate development,...

Zuken announces the release of E3.series 2025, introducing enhancements to support the designs of complex wiring systems. From sheet area assignment automation to simplifying part placement, this release has more than 50 improvements to the...