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Teledyne FLIR boosts Boson+ infrared thermal camera performance with embedded software upgrade

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Teledyne FLIR announced the next-generation embedded software for the ITAR-free Boson+ thermal camera module, delivering high performing uncooled thermal imaging technology for defense, firefighting, automotive, security, and surveillance...

Solido Simulation Suite provides customers order-of-magnitude faster verification for next-generation analog, mixed-signal and custom IC designs

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Siemens Digital Industries Software introduced Solido™ Simulation Suite software (“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate...

Siglent’s power rail probe SAP4000P for power integrity measurements

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Siglent releases SAP4000P 4GHz power rail probe, SP6150A 1.5GHz passive probe and SAP5000D 5GHz active differential probe new accessories. SAP4000P power rail probe offers high bandwidth, high sensitivity, very low noise, an extra-large offset...

New core in the dsPIC® Digital Signal Controller family to enhance precision and execution of real-time control

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As embedded systems become more complex and the need for enhanced performance increases, Microchip Technology has launched its dsPIC33A Core family of Digital Signal Controllers (DSCs). The ability for engineers to create sophisticated,...

LPKF is ready for increasing demand for glass substrates in the semiconductor industry

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The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing. Major changes in the...

ABB launches new NINVA™ with SIL2 certification for safer and simpler temperature measurement across industries

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ABB has launched an enhanced version of its NINVA™ TSP341-N non-invasive temperature sensor, delivering safer and simpler temperature measurements for applications in the chemical, oil and gas industries. The new NINVA is the first...

Harness Builder 2025 for E3.series with enhanced integration and documentation capabilities

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Zuken, a global leader in electrical and electronic digital engineering solutions, unveils the 2025 version of its industry-leading Harness Builder for E3.series software. This release introduces powerful new features and enhancements designed...

25.11. 2024 | Articles

New sustainable industrial printer

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Japanese green tech innovator Elephantech announced the release of their new industrial inkjet printing platform, the ELP04. A cutting-edge inkjet printer compatible with metal nano inks, the new platform uses cutting-edge technology to offer...

Transparent electronics: 45% transparency achieved in microdisplays

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Researchers from the Fraunhofer Institute for Photonic Microsystems IPMS have significantly increased the transparency of OLED microdisplays. Transparent electronics are already providing reliable services in some applications. For instance,...

electronica 2024: EMS services driving forward electronics production

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Electronic manufacturing services (EMS) are essential for modern electronics production and are the backbone of many industries. With the new EMS Pavilion, the PCB, EMS & Components Marketplace, and a ZVEI panel discussion, electronica 2024...