July 03, 2025 
Professional magazine and portal dedicated to electronics Articles
Nexperia enhances energy harvesting portfolio with innovative PMIC reducing BOM cost
Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. This advanced PMIC line combines superior performance, cost-efficiency, and versatility, setting a new standard in sustainable design for low...
New function/arbitrary waveform generator SDG1000X Plus
Siglent released the SDG1000X Plus series function/arbitrary waveform generator, providing engineers with a more flexible and efficient signal generation solution. This series offers a maximum output frequency of 60 MHz, 16-bit vertical...
World’s smallest class 006003 size (0.16 mm x 0.08 mm) chip inductor
Murata Manufacturing Co. Ltd announced the development of the world’s smallest class 006003-inch size (0.16 mm x 0.08 mm) chip inductor. This achievement represents a volume reduction of approximately 75% compared to the smallest 008004-inch size...
Bosch uses software and AI to make its products smarter and make people’s lives safer
Software and artificial intelligence (AI) are already shaping our present. For the future, however, they will be crucial. Bosch was quick to recognize the opportunities offered by intelligent software and services, and focused on them at an...
Research for the future, application transfer for the present
Picture.: 300-mm-Tools at CNT (© Fraunhofer IPMS) Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective. The...
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a...
Siemens unveils next generation AI-enhanced Electronic Systems Design software
Siemens Digital Industries Software announced the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™...
Renesas extends line-up for industrial Ethernet and multi-axis motor control solutions with high performance quad-core application processor
RZ/T2H MPU is ideal for industrial robots, PLCs, and motion controllers thanks to high-performance application processing and fast real-time control. Renesas Electronics Corporation launched the RZ/T2H, the highest performance microprocessor...
New step-down DC-DC converters with lowest quiescent current enhance design flexibility
The NEX30606 is a high-efficiency, high-accuracy step-down converter that offers a choice of 16 resistor-settable output voltages from input voltages ranging from 1.8 V to 5.0 V. It can deliver up to 600 mA of output current and offers...
Murata expands its range of ultra-compact and cost-effective tri-radio IoT communication modules
Murata Manufacturing Co., Ltd is expanding its innovative wireless communication module lineup by introducing the new Type 2FR/2FP and Type 2KL/2LL modules. Designed to support the next generation of wireless connectivity across smart home,...