July 02, 2025 
Professional magazine and portal dedicated to electronics Articles
STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters
New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects. STMicroelectronics, a global semiconductor leader serving customers across the spectrum...
New series of automotive grade LDOs offer high accuracy and ultra-low quiescent current
Nexperia introduced a new series of AEC-Q100 qualified general-purpose low-dropout (LDO) voltage regulators with ultra-low quiescent current. This new series includes tracking LDOs with high tracking accuracy and protected outputs, capable of...
Bosch aims to break the billion-euro barrier with sales revenue from factory software
Bosch is continuing its software offensive. The technology company’s Industrial Technology business sector is pursuing ambitious goals: by the beginning of the next decade, it wants its sales revenue from software and software-related services to...
Renesas extends mid-class AI processor line-up with RZ/V2N integrating DRP-AI accelerator for smart factories and intelligent cities of tomorrow
Realizing advanced endpoint vision AI while reducing system size and cost with a power-efficient MPU that eliminates the need for cooling fans. Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, expanded...
UNO-247 V2: Seamless integration for Industrial IoT evolution
Advantech, a global leader in the fields of IoT intelligent systems and embedded platforms, announces the launch of the UNO-247 V2, an industrial IoT gateway advancing its successful UNO-200 IoT automation gateway series. Powered by the Intel®...
Sonim Technologies transforms the XP Pro Thermal phone with Teledyne FLIR OEM Lepton
Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, and Sonim Technologies, a U.S.-based pioneer in rugged mobile solutions, unveiled its Thermal by FLIR collaboration bringing professional thermal imaging to the compact, rugged...
Introducing SAMA7D65 microprocessors available in System-in-Package and System-on-Chip with advanced graphics and connectivity features
Microchip’s SAMA7D65 MPU runs 1 GHz Arm® Cortex®-A7 core and integrates MIPI DSI®, LVDS display interfaces and 2D GPU for Human-Machine Interface (HMI) applications. Embedded developers must address the challenge of designing systems that...
Smallest PCB footprint and highly reliable: Angled M12 SMT Ruggedized connectors from Provertha
Provertha develops the first 90° angled M12 SMT Ruggedized connectors for maximum functional reliability in front-side interfaces. Provertha is expanding its circular connector portfolio with the new angled M12 Ruggedized connector series in...
Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
Siemens Digital Industries Software announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel. This includes...
Renesas 365, powered by Altium: Groundbreaking industry solution for software-defined products
New industry solution marks major milestone following Renesas’ acquisition of Altium, ushering in new era of electronics system development. Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium, a...