April 29, 2024 
Professional magazine and portal dedicated to electronics 
In many miniaturized electronics applications, conventional cable wiring is both costly and material-intensive. It also limits the scope for innovation and product performance. The HyPerStripes (Hybrid integrated high performance electronic...
Discover the ultimate tech-powered revolution at the IOT Solutions World Congress 2024 The IOT Solutions World Congress (IOTSWC), the leading international event on industry transformation through disruptive technologies, returns in 2024 to...
The German DIE Bonder specialist Tresky GmbH introduced its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement...
Highly configurable PIC32CZ CA devices are available with a 300 MHz Arm® Cortex®-M7 processor. Industrial and consumer application designers must consider implementing security functionality in their devices during the development process...
Robust protection devices minimize their impact on signal integrity Nexperia, the expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data...
Future Offerings to Include R-Car SoCs with Advanced In-Package Chiplet Integration Technology and Arm-Based Automotive MCUs Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, laid out plans for its...
New wireless microcontroller and turnkey module with evaluation board expand choices to simplify and accelerate design. STMicroelectronics has released two new products to enable the next generation of better, smaller, and longer lasting smart...
Vishay Intertechnology, Inc. announced the release of a new series of wet tantalum capacitors with hermetic glass-to-metal seals. For avionics and aerospace applications, the STH electrolytic capacitors provide all the advantages of Vishay’s...
Perex: LOPEC, the world’s leading exhibition and conference for flexible, organic and printed electronics, will be held in Munich from March 5 to 7, 2024. Under the focus topic of Smart Living, companies and researchers will show how printed...
The biggest challenge for data acquisition using sensors is understanding what you are measuring and getting the right sensor for the job. For accurate and meaningful measurements, engineers must be able to calibrate their sensors so that...
