Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimized for protecting and filtering high-speed data communication links which are increasingly used in modern cars. Applications like in-vehicle camera video-links, multi-gigabit automotive Ethernet networks as well as infotainment interfaces like USBx, HDMIx, and PCIex, can be protected against potentially damaging ESD events.

Flip-chip packages have minimal parasitic components – they come without bond wires or copper lead frames resulting in high performance and excellent signal integrity. Nexperia’s new 2- and 3-pin FC-LGA diodes have ultra-low capacitance (<0.25pF) and insertion loss (-3dB at 14.6GHz) – features that are key for use in high data rate applications. Both flip-chip packages, the 2-pin DFN1006L(D)-2 and the 3-pin DFN1006L(D)-3, share the same footprint as their standard counterparts, ensuring drop-in compatibility. They offer up to 6 GHz bandwidth improvement compared to conventional DFN technologies. Moreover, the 3-pin devices’ ability to protect two channels and offer capacitance matching saves more space while further improving circuit performance and stability (more info).