News

From 19 - 21 June in Cambridge, UK, IDTechEx will host six half day business intelligence forums covering the latest innovations with Off Grid Energy Independence, Electric Vehicles, Li-ion Batteries and Supercapacitors. The forums are an ideal...

Teledyne LeCroy announced the WavePro HD high-definition oscilloscopes, which combine for the first time HD4096 12-bit technology and 8 GHz bandwidth for low noise and pristine signal fidelity. With a maximum of 5 Gpoints of fast, responsive, and...

A highly successful CHINAPLAS 2018 concluded its four-day show on April 27, 2018, in Shanghai. The rainy weather prior to the opening of the 32nd edition of show did not hamper the enthusiasm of visitors, who were inspired by smart manufacturing,...

RS Components has worked with Cypress Semiconductor and MikroElektronika to create Clicker 2 for PSoC® 6, the development kit for faster prototyping with Cypress’ PSoC 6 ultra-low-power microcontrollers (MCUs). Bridging the gap...

EM Microelectronic announced the release of its EM3028 Extreme low power Real-Time Clock (RTC) module, setting a new industry benchmark for accuracy and power consumption. EM3028 leads the way for green IoT applications, with 50% extended battery...

RS Components has announced the launch of two new products from Aim-TTi (Thurlby Thandar Instruments). The launch also celebrates the working partnership between RS and Aim-TTi, which has been ongoing now for 40 years. The TGF3000 series is the...

Renesas announced an expansion of its healthcare solution lineup with the launch of a new blood pressure monitoring evaluation kit. The new blood pressure monitoring evaluation kit comprises hardware and software elements needed to jump start...

The final round, which took place at the IQRF Summit 2018, was attended by the solvers of the two best projects selected from the projects submitted to the final. Both projects came from the VŠB - Technical University of Ostrava....

Vishay introduced new 200 V FRED Pt® Ultrafast recovery rectifiers in the thermally efficient FlatPAK™ 5x6 package with a low profile of < 1 mm. With long term reliability assured through 2000 hours of high temperature reverse bias...

The SMT Hybrid Packaging will soon be taking place at the Nuremberg exhibition center inviting exhibitors, participants of the conference and visitors to greatly benefit from intensifying personal contacts and the exchange of information available...