March 10, 2025 
Professional magazine and portal dedicated to electronics 
Packaging, one of the main application areas of plastics, has recently undergone drastic changes. On one hand, the growing spending power of the middle class has been pushing packaging towards the high end of being intelligent and personalized. On...
Renesas Electronics announced three new Target Boards for the RX65N, RX130 and RX231 Microcontroller (MCU) Groups, each designed to help engineers jump start their home appliance, building and industrial automation designs. Priced below $30 USD,...
Texas Instruments introduced two new 4-V to 36-V power modules that measure just 3.0 mm by 3.8 mm and require only two external components for operation. The 0.5-A LMZM23600 and 1-A LMZM23601 DC/DC step-down converters achieve up to 92 percent...
Premier Farnell, The Development Distributor, is now stocking the LDH400P Electronic Load from Aim TTi, manufacturers of advanced electronic test and measurement equipment and laboratory power supplies, specifically for electronic design...
Win a PICDEM LCD 2 Demonstration Board from DPS. The PICDEM LCD 2 Demonstration Board (DM163030) shows the main features of Microchip’s 28, 40, 64 and 80-pin LCD Flash PIC microcontrollers including the LCD voltage booster and contrast...
Registration for extensive program offered by the SMT Hybrid Packaging Conference 2018 is now open. Participants can benefit from attractive early bird prices via the homepage of the event at smthybridpackaging.com/conference. Practical and...
There is a great deal of design effort and complexity associated with creating an industrial-grade microprocessor (MPU)-based system running a Linux® operating system. Even developers with expertise in the area spend a lot of time on PCB...
Now in its 16th year, embedded world has once again impressively demonstrated that there is a good reason why it is known as the leading exhibition for the international embedded community. It was larger again in 2018, with more trade visitors,...
Renesas announced two new fully encapsulated digital DC/DC PMBus® power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to...
NI announced the PXIe-4163 high-density source measure unit (SMU), which provides six times more DC channel density than previous NI PXI SMUs for testing RF, MEMS, and mixed-signal and other analog semiconductor components. Chipmakers have...
