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Nordson Electronics Solutions expands the SELECT® Synchro™ selective soldering equipment family with new Synchro 3 release

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Non-stop selective soldering delivers results during electronics manufacturing to increase throughput and flexibility while reducing footprint and cost-of-ownership Nordson Electronics Solutions, a global leader in reliable electronics...

NXP breaks through integration barriers for software-defined vehicle development with open S32 CoreRide platform

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NXP Semiconductors breaks through the integration barriers for next-generation software-defined vehicle (SDV) development with the introduction of its S32 CoreRide platform. The new industry-first vehicle software platform greatly simplifies...

Heatsink innovations for the printed circuit board

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So-called PCB heatsinks are used very often when targeted heat dissipation of electronic components on the PCB is required. Printed circuit board heatsinks from Fischer Elektronik offer excellent solutions for component heat dissipation from...

ROHM develops a new operational amplifier that minimizes current consumption

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Industry-low 160nA current consumption improves power savings in consumer and industrial equipment. ROHM has developed a linear operational amplifier (op amp) - LMR1901YG-M - featuring the lowest* current consumption in the industry. This makes...

STMicroelectronics extends brand protection with NFC tags featuring state-of-the-art on-chip digital signature

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State-of-the-art technology protects high-value product’s journey through the supply chain and consumers with blockchain-compatible elliptic curve cryptography. STMicroelectronics’ ST25TA-E NFC tag IC strengthens the security of digital product...

How to work with the intelligent factory

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The intelligent factory works with production teams, through powerful software tools, to raise productivity by improving production plans, minimising stoppages, and accelerating troubleshooting Intelligent Factory has become a manufacturing...

Si2-Series of acoustic imagers detect compressed air leaks, partial discharges, mechanical faults and quantify gas leaks

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New models provide best-in-class performance, decision support, fleet management and enterprise data integration with new on-screen gas leak quantification, partial discharge assessment, and mechanical fault measurement. FLIR, a Teledyne...

New AI accelerator for lightweight AI models and embedded processor technology to enable real-time processing

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Renesas Electronics Corporation announced the development of embedded processor technology that enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI. The newly developed technologies...

The SMTconnect 2024: Increased synergy effects between electronics production and power electronics

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The countdown is on – in one month, the trade fair for microelectronics will once again bring people and technologies together in the exhibition halls of Nuremberg, Germany. From 11 – 13 June 2024, the event will offer a platform for experts in...

Fraunhofer IPMS develops new multi-sensor system for water analysis

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With groundbreaking developments in the field of chemical sensor technology, the Fraunhofer Institute for Photonic Microsystems IPMS is setting new standards in the assessment of water quality for humans and the environment. In addition to key...