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The new photonics bonder for sub-micron use in nano- and optoelectronics

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The German DIE Bonder specialist Tresky GmbH introduced its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement...

New 32-bit MCU features an embedded hardware security module to safeguard industrial and consumer applications

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 Highly configurable PIC32CZ CA devices are available with a 300 MHz Arm® Cortex®-M7 processor. Industrial and consumer application designers must consider implementing security functionality in their devices during the development process...

Ultra-low capacitance ESD diodes protect automotive data interfaces

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Robust protection devices minimize their impact on signal integrity Nexperia, the expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data...

Processor roadmap for next-gen automotive SoCs and MCUs

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Future Offerings to Include R-Car SoCs with Advanced In-Package Chiplet Integration Technology and Arm-Based Automotive MCUs Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, laid out plans for its...

STMicroelectronics eases development of smaller and longer-lasting smart Bluetooth devices with two new products

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New wireless microcontroller and turnkey module with evaluation board expand choices to simplify and accelerate design. STMicroelectronics has released two new products to enable the next generation of better, smaller, and longer lasting smart...

SuperTan® tantalum-cased wet tantalum capacitors provide military H-level shock and vibration capabilities

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Vishay Intertechnology, Inc. announced the release of a new series of wet tantalum capacitors with hermetic glass-to-metal seals. For avionics and aerospace applications, the STH electrolytic capacitors provide all the advantages of Vishay’s...

LOPEC 2024: Printed electronics serving patients

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Perex: LOPEC, the world’s leading exhibition and conference for flexible, organic and printed electronics, will be held in Munich from March 5 to 7, 2024. Under the focus topic of Smart Living, companies and researchers will show how printed...

Are TEDS-enabled sensors worth investing in?

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The biggest challenge for data acquisition using sensors is understanding what you are measuring and getting the right sensor for the job. For accurate and meaningful measurements, engineers must be able to calibrate their sensors so that...

New eBook offers expert insights on embedded security

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Mouser Electronics, Inc. announced a new eBook produced in collaboration with global semiconductor leader Analog Devices, Inc. (ADI), which explores strategies for overcoming challenges facing designers of embedded security. Today's embedded...

ROHM’s new high power 120W laser diode for LiDAR

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Increasing measurement range by reducing wavelength temperature dependence by 66% ROHM has developed a high-power laser diode – the RLD90QZW8. It is ideal for industrial equipment and consumer applications requiring distance measurement...