December 27, 2024 
Professional magazine and portal dedicated to electronics 
Solid Sands, the world-leading provider of testing and qualification technology for compilers and libraries, announces a major new update to SuperGuard, the world’s first requirements-based test suite for C standard libraries. Based on the...
Diodes Incorporated has introduced a new versatile single-channel high-side power switch. The DIODES™ AP22980 features three different selectable slew rates, so that wider capacitance loads can be handled while keeping inrush currents down,...
element14, an Avnet community, is celebrating its engineers and the winter holidays in the U.S. by combining giving back and ingenuity through three holiday-themed offerings including an Engineer/STEM Holiday Shopping Wishlist, an end-of-year...
TDK Corporation presents the new B78302A series of compact EPCOS transformers with innovative E5 cores for ultrasonic applications. It comprises three types with transformation ratios between 1:1:10.8 and 1:1:15.3. Depending on the type, the...
GW Instek announced that it has launched the new GSM-20H10 precision DC source meter to officially enter the source meter equipment market in order to showcase GW Instek's extensive experience in power measurement applications, and the combined...
LOPEC will be opening its doors at the Messe München ICM from February 28 to March 2, 2023. The focus topic Mobility will be the common thread running through the world’s leading exhibition and conference for flexible, organic, and printed...
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is proud to announce their support of the PENSKE AUTOSPORT group and the newly formed DS PENSKE Formula E team. For the upcoming ninth season of the ABB...
Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade...
congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini...
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization. The...
