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Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration

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Teledyne FLIR, part of Teledyne Technologies Incorporated, announced the expansion of the Boson+ thermal camera module product line with twenty-four compact models featuring 320 x 256 resolution. Radiometry, the ability to take the temperature of...

11.05. 2023 | News

IPC Hand Soldering Competition for the first time ever in italy at Focus on PCB 2023

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The IPC Hand Soldering Competition is coming to Italy for the first time, and will make its debut at 'Focus on PCB - From Design to Assembly', the European trade show dedicated to the printed circuit boards industry to be held in Vicenza on 17 and...

09.05. 2023 | News

New MPLAB® SiC Power Simulator Allows Customers to Test Microchip’s SiC Power Solutions in Design Phase

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The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss and...

08.05. 2023 | News

TI pioneers the industry's first stand-alone active EMI filter ICs, supporting high-density power supply designs

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Texas Instruments debuted the industry’s first stand-alone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system...

05.05. 2023 | News

Keysight Introduces 2 GHz Real-Time Spectrum Analysis Solution for Satellite Communications Operators

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Keysight Technologies announces a real-time spectrum analysis (RTSA) solution enabling up to 2 GHz RTSA bandwidth for use with the Keysight N9042B UXA Signal Analyzer. The software-based RTSA solution monitors satellite signals and interference,...

04.05. 2023 | News

Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect

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Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line exhibition at SMTconnect, May 9-11 in Nuremberg, Germany. Organized by the...

03.05. 2023 | News

New DC energy meter provides kWh-based charging experience for DC wallboxes satisfying latest regulations

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Electrical measurement technology specialist LEM will use PCIM 2023 to give the global e-mobility market advance notice of its new DC energy meter for DC wallbox chargers of electric vehicles (EVs). Offering compliance to all the latest metrology...

02.05. 2023 | News

First AI-enhanced smart accelerometers from ST raise performance and efficiency for always-aware applications

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STMicroelectronics has launched three new accelerometers with advanced processing engines built-in to extend sensor autonomy, enabling systems to respond more quickly to external events while lowering power consumption. The LIS2DUX12 and...

01.05. 2023 | News

Nexperia introduces the first application-specific MOSFETs for hotswap in SMD copper-clip LFPAK88 packaging

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Nexperia announced the release of its first 80 V and 100 V application-specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in a compact 8x8 mm LFPAK88 package. These new ASFETs are fully optimized for demanding hotswap...

28.04. 2023 | News

New LEM current sensor delivers best-in-class charge measurement accuracy for Li-ion EV batteries

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One of the biggest issues in the EV sector is the need to develop vehicles that can travel the furthest possible distances between charges and so design engineers are continually searching for sensors that can offer the superior levels of...

27.04. 2023 | News