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Improving ADAS and AV safety with Teledyne FLIR thermal-imaging integration and Ansys AVxcelerate Suite

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Improving vehicle perception in all weather and lighting conditions is critical to reducing the record number of pedestrian fatalities in the United States and making autonomous vehicle (AV) systems safer. In June 2023, GHSA projected that 7,508...

Innovative fault location system for the repair of PCBs 

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The new GRS200 fault locator system from Polar Instruments is based on proven Analog-Signature-Analysis, comparing the nodal impedance between an unpowered known good board and a faulty PCB. It allows to find typical production faults in...

Onsemi: Lowest power image sensor family for smart home and office

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Onsemi introduced the Hyperlux LP image sensor family ideally suited for industrial and commercial cameras such as smart doorbells, security cameras, AR/VR/XR headsets, machine vision and video conferencing. These 1.4 µm pixel sensors deliver...

Machine Learning on the edge

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Today’s need for AI and ML ​ Artificial intelligence (AI) and Machine learning (ML) are used in many applications, in industries as diverse as travel, banking and financial services, manufacturing, food technology, healthcare, logistics,...

How to Easily Achieve Superior Audio Performance with Plug and Play Digital-Input Class D Amplifiers

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Abstract This article introduces a family of plug and play Class D amplifiers that simplifies a system design by eliminating the usual need for I2C programming, low jitter sample clocks, logic level shifters, careful board design, or EMI...

Infineon uses recyclable PCBs from Jiva Materials

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With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing the carbon footprint and promoting sustainability are therefore key to achieving...

Siemens unveils Calibre DesignEnhancer for Calibre correct-by-construction IC layout optimization

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Siemens Digital Industries Software today introduces Calibre® DesignEnhancer software, an innovative solution that enables integrated circuit (IC), place-and-route (P&R) and full-custom design teams to dramatically improve productivity, boost...

Yamaha Robotics to present advanced assembly automation at productronica 2023

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Yamaha Robotics will display the latest-generation 1 STOP SMART SOLUTION at A3.323 at Productronica 2023, bringing together the complete set of new YR series printers, surface-mounters and inspection machines. The new YRM20DL dual-lane mounter...

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

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Teledyne FLIR, part of Teledyne Technologies Incorporated, announced the release of its much-anticipated Lepton 3.1R, the world’s first radiometric thermal camera module with a 95-degree field of view (FOV), 160 x 120 resolution, and a scene...

Bosch opens new semiconductor test center for chips and sensors in Malaysia

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Global demand for chips for the automotive and consumer goods industries remains high. That is why Bosch is continuing to expand its semiconductor business. The company has opened a new test center for chips and sensors in Penang, Malaysia, at a...