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Sensors: the trailblazers of digitalization

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Sensors are the key technology used by smart systems in a connected world. As the leading data supplier, they produce the raw material used in digitalization systems throughout the entire value chain in virtually all industrial segments. Leading...

10.09. 2022 | News

Nexperia releases the smallest DFN MOSFETs in the world

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Nexperia announced the release of a new range of 20 V & 30 V MOSFETs in the world’s smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET...

09.09. 2022 | News

ST launches multi-connectivity development kit for indoor and outdoor asset tracking

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The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit...

08.09. 2022 | News

Specialist EEE distributor Princeps appointed by leading EMC interconnect manufacturer KEC

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Princeps, the accredited specialist distributor of obsolete and difficult-to-source electronic, electrical and e-mech components for advanced industries, announces a franchise agreement with specialist UK interconnect manufacturer KEC...

07.09. 2022 | News

New BeagleBone® AI-64 SBC now available from stock at Farnell

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BeagleBone® AI-64 SBC board is the first 64-bit open hardware single board computer from BeagleBoard.org designed for building performance-optimised embedded applications. Farnell is now selling from stock the new BeagleBone® AI-64 SBC...

06.09. 2022 | News

35 A GaN ePower Stage IC Boosts Power Density and Simplifies Design

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EPC announces the introduction of a 100 V, 35 A integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23102 eGaN IC is...

05.09. 2022 | News

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

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Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, introduces a system-solution for dispensing single-component (1K) thermal interface materials by integrating the ASYMTEK Helios® SD-960 Series fluid...

03.09. 2022 | News

SIGLENT Technologies releases new handheld oscilloscopes

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SIGLENT Technologies has recently released two “5-in-1” handheld oscilloscope families, the SHS800X and SHS1000X series of portable measurement products which integrate a dual-channel oscilloscope, multimeter, serial triggering and decoding,...

01.09. 2022 | News

North American PCB Industry Sales Up 4.5 Percent in July

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IPC announced the July 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98. Total North American PCB shipments in July 2022 were up 4.5 percent compared to the same month...

31.08. 2022 | News

Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions

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Anritsu Company introduces the IQ Signal Master MX280005A Vector Signal Analysis software that delivers expanded post processing measurements and analysis of IQ data files captured on Anritsu Field Master Pro™ MS2090A, Remote Spectrum Monitor...

30.08. 2022 | News