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Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

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Nexperia announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation...

17.06. 2022 | News

Teledyne FLIR Introduces Hadron 640R Dual Thermal-Visible Camera for Unmanned Systems

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Teledyne FLIR, part of Teledyne Technologies Incorporated, announced the release of its high-performance Hadron 640R combined radiometric thermal and visible dual camera module. The Hadron 640R design is optimized for integration into unmanned...

16.06. 2022 | News

Indium Corporation Introduces AuSn Pastes for High-Power LEDs

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Indium Corporation® has expanded its portfolio of proven pastes with two new AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive,...

15.06. 2022 | News

embedded award 2022: These are the nominees

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For the 18th time in a row, an international jury of industry experts will present the annual embedded award. On 21st June, 2022, the first day of the 20th anniversary of the embedded world Exhibition & Conference, the coveted prize will be...

14.06. 2022 | News

PIC® and AVR® Microcontrollers Anchor the Majority of Embedded Designs Today

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With smartphones, autonomous vehicles, and 5G wireless connectivity dominating the landscape of embedded design in 2022, Microchip’s 8-bit PIC® and AVR® microcontroller (MCU) families are gaining market share. Over the past 50 years, the market...

13.06. 2022 | News

Higher Costs Continue to Dominate Electronics Industry Narrative

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Per IPC’s June Global Sentiment of the Electronics Supply Chain report, nine in 10 electronics manufacturers surveyed are currently experiencing rising material costs, while 86 percent of electronics manufacturers are concerned about inflation....

11.06. 2022 | News

TI drives isolation technology forward with new solid-state relays that provide industry-leading reliability

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Building on more than two decades of experience developing new isolation manufacturing technologies and integrated circuits (ICs) for high-voltage systems, Texas Instruments introduced a new portfolio of solid-state relays, including...

10.06. 2022 | News

LEM to unveil the world’s first Integrated Current Sensor with Sigma Delta bitstream output

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LEM announced the launch of HMSR DA, the first Integrated Current Sensor on the market to offer a Sigma Delta bitstream output. LEM’s new product has been designed to provide a solution to industries requiring clean signals and facing significant...

09.06. 2022 | News

Find What You Need with Ease with Mouser’s Online Services and Tools and Help Center

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Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, offers a wealth of customer-focused online tools to simplify and optimize the...

08.06. 2022 | News

Vicor opens industry’s first “ChiP” fabrication facility

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Vicor celebrated the opening of its new, state-of-the-art power module manufacturing facility.  The world’s first ChiP™ (Converter housed in Package) fabrication facility enables the most scalable, automated, cost-effective manufacturing of...

07.06. 2022 | News