IPC announces the release of five newly revised standards covering several areas of the supply chain:
For printed boards, IPC-2223E will provide designers of flexible/rigid-flexible designs with updated figures, new sections and comments on microvia stacking, back drilled holes and dual row zero insertion force (ZIF) connectors.
IPC-6102E provides new acceptance criteria for back drilled holes, discussion on reliability issues for microvia structures in Class 3 products, and establishes new requirements for copper wrap plating of holes in new designs.
For those involved with wire harness requirements and acceptance IPC/WHMA-A-620D provides some new acceptability criteria, figures and graphics on target conditions, solderless wrap section revisions, and a new section added on over-molding of flexible flat ribbon.
The connected factory exchange (CFX) standard, IPC-2591 V1.1 provides changes made to message sections and message structure sections. Appendix A was added with a short description of all changes from V1.0 and Appendix B provides acronyms and abbreviations.
IPC-1791A provides a new Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations. Several sections have been updated and added to 1 scope and 3.0 requirements.
IPC would like to thank the many committee members for their participation in developing standards for the electronics industry to help build electronics better.
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