Analysis SMT Hybrid Packaging 2017: Impressive satisfaction of exhibitors and visitors

25.07. 2017 | News
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As a solution orientated exhibition with conference, the SMT Hybrid Packaging lured many visitors and exhibitors from all over the world to the Nuremberg exhibition center from 16 – 18 May 2017.

At three intensive event days, experts of system intergration in microelectronics came together.

More about the final facts and figures you will find in our press release.

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