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TDK offers compact shielded transformers for ultrasonic applications

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TDK Corporation presents the new B78302A series of compact EPCOS transformers with innovative E5 cores for ultrasonic applications. It comprises three types with transformation ratios between 1:1:10.8 and 1:1:15.3. Depending on the type, the...

23.12. 2022 | News

GSM-20H10 precision DC source meter is poised to seize the semiconductor component testing market

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GW Instek announced that it has launched the new GSM-20H10 precision DC source meter to officially enter the source meter equipment market in order to showcase GW Instek's extensive experience in power measurement applications, and the combined...

22.12. 2022 | News

LOPEC 2023: Printed Electronics for greater safety and sustainability in traffic

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LOPEC will be opening its doors at the Messe München ICM from February 28 to March 2, 2023. The focus topic Mobility will be the common thread running through the world’s leading exhibition and conference for flexible, organic, and printed...

21.12. 2022 | News

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 9

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Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is proud to announce their support of the PENSKE AUTOSPORT group and the newly formed DS PENSKE Formula E team. For the upcoming ninth season of the ABB...

20.12. 2022 | News

TI expands space-grade product portfolio with radiation-hardened and radiation-tolerant plastic packages

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Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade...

19.12. 2022 | News

Mini form factor for maximum performance

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congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini...

17.12. 2022 | News

STMicroelectronics launches a new advanced 6-axis IMU with embedded sensor fusion and AI

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ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization. The...

16.12. 2022 | News

Prevents latent defective battery leakage that can cause fires. Battery insulation tester BT5525 Released

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The Battery insulation tester BT5525 is often used in production lines for LIB (lithium-ion battery) battery cells. It is a device to detect insulation defects that cause battery ignition or reduce longevity. Until now, it has been difficult to...

15.12. 2022 | News

IPC Issues New Report, The Evolution of Factories on the Future: What You Need to Know

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IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many...

14.12. 2022 | News

Vicor Powering Innovation podcast explores electric aircraft with Ampaire

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Vicor announced the release of episode #3 in its podcast series on world-changing technologies, Powering Innovation. This episode examines the growth, challenges and benefits of electrifying aircrafts and hybrid-electric planes. In this third...

13.12. 2022 | News