March 13, 2025 
Professional magazine and portal dedicated to electronics 
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is proud to announce their support of the PENSKE AUTOSPORT group and the newly formed DS PENSKE Formula E team. For the upcoming ninth season of the ABB...
Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade...
congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini...
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization. The...
The Battery insulation tester BT5525 is often used in production lines for LIB (lithium-ion battery) battery cells. It is a device to detect insulation defects that cause battery ignition or reduce longevity. Until now, it has been difficult to...
IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many...
Vicor announced the release of episode #3 in its podcast series on world-changing technologies, Powering Innovation. This episode examines the growth, challenges and benefits of electrifying aircrafts and hybrid-electric planes. In this third...
Power Integrations announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride...
Mid-range FPGAs and System-on-Chip (SoC) FPGAs have played a major role in moving computer workloads to the network edge. Microchip Technology has helped fuel this transition with its award-winning FPGAs, while also delivering the first...
Nexperia announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include four 650 V, 1 A parts available in CFP3 and CFP5 packages intended for use in...
