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Yamaha supplies surface-mount equipment from 1 STOP SMART SOLUTION to Faber Electronics

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Yamaha Motor Europe SMT Section is supplying high-speed equipment for two surface-mount lines at Faber Electronics, to build high-tech products including IoT equipment, automotive electronics, medical devices, and industrial controls. Faber...

14.09. 2022 | News

Anritsu bringing its most advanced Signal Testing and Device Characterization Solutions to European Microwave Week 2022

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Anritsu is attending the European Microwave Exhibition, the largest trade show dedicated to Microwaves and RF in Europe, showing its most advanced testing solutions for signal generation and signal analysis. Microwave technologies are used by a...

13.09. 2022 | News

Microchip Expands Its Portfolio of MPU-Based System-on-Modules with the SAM9X60D1G-SOM

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As the embedded market continues to grow rapidly and evolve, developers are seeking to optimize product development, or they may need to transition from a microcontroller (MCU) to a microprocessor (MPU) to handle increased processing requirements....

12.09. 2022 | News

Sensors: the trailblazers of digitalization

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Sensors are the key technology used by smart systems in a connected world. As the leading data supplier, they produce the raw material used in digitalization systems throughout the entire value chain in virtually all industrial segments. Leading...

10.09. 2022 | News

Nexperia releases the smallest DFN MOSFETs in the world

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Nexperia announced the release of a new range of 20 V & 30 V MOSFETs in the world’s smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET...

09.09. 2022 | News

ST launches multi-connectivity development kit for indoor and outdoor asset tracking

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The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit...

08.09. 2022 | News

Specialist EEE distributor Princeps appointed by leading EMC interconnect manufacturer KEC

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Princeps, the accredited specialist distributor of obsolete and difficult-to-source electronic, electrical and e-mech components for advanced industries, announces a franchise agreement with specialist UK interconnect manufacturer KEC...

07.09. 2022 | News

New BeagleBone® AI-64 SBC now available from stock at Farnell

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BeagleBone® AI-64 SBC board is the first 64-bit open hardware single board computer from BeagleBoard.org designed for building performance-optimised embedded applications. Farnell is now selling from stock the new BeagleBone® AI-64 SBC...

06.09. 2022 | News

35 A GaN ePower Stage IC Boosts Power Density and Simplifies Design

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EPC announces the introduction of a 100 V, 35 A integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23102 eGaN IC is...

05.09. 2022 | News

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

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Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, introduces a system-solution for dispensing single-component (1K) thermal interface materials by integrating the ASYMTEK Helios® SD-960 Series fluid...

03.09. 2022 | News