ams, X-Rite and Pantone to develop a mobile color sensing solution


ams, X-Rite, and X-Rite’s subsidiary Pantone LLC today announced a collaboration to develop an end-to-end mobile solution that embeds color management technology directly into a smartphone for accurate color matching. The joint solution...

15.03. 2018 | News

SMT Hybrid Packaging 2018: Total view of systems integration in microelectronics


Taking a holistic view of systems integration in microelectronics, the SMT Hybrid Packaging is unique in its approach. From 5 – 7 June 2018, visitors are invited to examine all the technical processes in the production of electronic...

14.03. 2018 | News

Join the Bandwagon of Green Efficient Smart Manufacturing. The New Era of Packaging


Packaging, one of the main application areas of plastics, has recently undergone drastic changes. On one hand, the growing spending power of the middle class has been pushing packaging towards the high end of being intelligent and personalized. On...

13.03. 2018 | News

Renesas Introduces Low-Cost Target Boards to Support Growing RX 32-bit MCU Family


Renesas Electronics announced three new Target Boards for the RX65N, RX130 and RX231 Microcontroller (MCU) Groups, each designed to help engineers jump start their home appliance, building and industrial automation designs. Priced below $30 USD,...

12.03. 2018 | News

Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent


Texas Instruments introduced two new 4-V to 36-V power modules that measure just 3.0 mm by 3.8 mm and require only two external components for operation. The 0.5-A LMZM23600 and 1-A LMZM23601 DC/DC step-down converters achieve up to 92 percent...

09.03. 2018 | News

Premier Farnell now stocking the Aim TTi LDH400P Electronic Load


Premier Farnell, The Development Distributor, is now stocking the LDH400P Electronic Load from Aim TTi, manufacturers of advanced electronic test and measurement equipment and laboratory power supplies, specifically for electronic design...

08.03. 2018 | News

Win a Microchip PICDEM LCD 2 Demonstration Board


Win a PICDEM LCD 2 Demonstration Board from DPS. The PICDEM LCD 2 Demonstration Board (DM163030) shows the main features of Microchip’s 28, 40, 64 and 80-pin LCD Flash PIC microcontrollers including the LCD voltage booster and contrast...

07.03. 2018 | News

SMT Hybrid Packaging 2018: Conference and tutorial registration now open


Registration for extensive program offered by the SMT Hybrid Packaging Conference 2018 is now open. Participants can benefit from attractive early bird prices via the homepage of the event at Practical and...

06.03. 2018 | News

Simplify Industrial-Grade Linux Designs with SAMA5D2 MPU-Based SOM


There is a great deal of design effort and complexity associated with creating an industrial-grade microprocessor (MPU)-based system running a Linux® operating system. Even developers with expertise in the area spend a lot of time on PCB...

05.03. 2018 | News

Going for a record: embedded world continues to grow!


Now in its 16th year, embedded world has once again impressively demonstrated that there is a good reason why it is known as the leading exhibition for the international embedded community. It was larger again in 2018, with more trade visitors,...

05.03. 2018 | News

Renesas Unveils Fully Encapsulated Dual 30A and Single 33A Digital Power Modules


Renesas announced two new fully encapsulated digital DC/DC PMBus® power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to...

02.03. 2018 | News

NI Improves PXI SMU Channel Density for the STS by 6X


NI announced the PXIe-4163 high-density source measure unit (SMU), which provides six times more DC channel density than previous NI PXI SMUs for testing RF, MEMS, and mixed-signal and other analog semiconductor components. Chipmakers have...

01.03. 2018 | News

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