Nexperia announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes:
Leadless DFN packages are up to 90% smaller than SOT23 packages and this helps to reduce the amount of board space required for the rapidly increasing number of electronic components being used in the latest vehicles. The side-wettable flank feature offers very reliable automated optical inspection (AOI) of solder joint quality (more info).