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Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package

14.05. 2021 | News
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Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters.

The new package provides a half-bridge solution in one device, occupying 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks, whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability of 98 A (more info).

LFPAK56D