December 24, 2024 
Professional magazine and portal dedicated to electronics 
Infineon Technologies is presenting the fourth generation of its REAL3™ image sensor IRS2771C. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure user authentication like face or hand recognition to unlock the device and confirm payments. In addition, the 3D ToF chip enhances augmented reality, morphing and photo (e.g. bokeh) effects and can be used to scan a room.
Measuring only 4.6 x 5 mm, the image sensor features a 150 k (448 x 336) pixel output that comes close to the HVGA standard resolution. This makes the resolution four times higher than that of most ToF solutions on the market today. The pixel array is highly sensitive to 940 nm infrared light and provides unbeaten outdoor performance. This is enabled by the patented Suppression of Background Illumination (SBI) circuitry in every pixel.
More information about Infineon’s 3D image sensor family is available at www.infineon.com/real3.
