SMT Hybrid Packaging 2018: Total view of systems integration in microelectronics

14.03. 2018 | News

Taking a holistic view of systems integration in microelectronics, the SMT Hybrid Packaging is unique in its approach. From 5 – 7 June 2018, visitors are invited to examine all the technical processes in the production of electronic assemblies – from the idea and development to the final production.

Market overview of the entire industry

Numerous new exhibitors and key players in the industry offer a wide overview of the entire value chain, presenting their new product innovations and showing new trends and developments of the industry. As yet, the number of registered exhibitors for this year are higher compared to the same time last year.

Highlights in 2018

Once again in 2018, the SMT Hybrid Packaging will be offering numerous highlights. The production line “Future Packaging” on “Intelligent automation for e-mobility and robotics” presents the entire production process in hall 5, stand 5-434. Visitors can experience all steps of production and discuss issues and challenges together with experts.

At the annually Hand Soldering Competition, showcased by the worldwide trade and standardization organization IPC – Association Connecting Electronics Industries from the USA, experts in soldering will have the opportunity to demonstrate their skills. Over three days, competitors will face each other and practice speed and precision – part of the evaluation criteria required for the manual soldering of complex circuit boards.

A premier this time around takes the form of a Hand Soldering Competition for Young Professionals at the SMT Hybrid Packaging. This competition follows the same rules as the competition for the experts, but will include a circuit board assembly, which is adapted to the skills of the beginners.

Joint stands provide specific topics for broad professional audience

Companies wishing to present their products and solutions as exhibitors will have the chance to do so in a “Newcomer Pavilion“. The Pavilion offers cost-effective pricing and full-service package. By doing so, companies can test their presence at the exhibition presence with little organizational effort.

Besides the Newcomer Pavilion there are more joint stands being planned for the SMT Hybrid Packaging 2018. Exhibitors can benefit from favorable conditions and a special application for the broad professional audience.

The joint stand “Mixed Double – PCB meets Components” displays circuit boards, modules and materials on an action zone. The “EMS-Intersection” joint stand is a platform for contract manufacturers. Products and solutions regarding optoelectronics will be shown by the joint stand “Optics meets Electronics”.

Conference and tutorials offer a high quality training program

The conference will continue to provide the latest know-how, provide the latest information on trends and practical uses along the entire value chain of the production of electronic assemblies in 2018.

On 6 June 2018 a range of English tutorials will take place. These will include sessions such as “Comparative Assessment of Temperature Mission Profiles or Component Qualification” and “Preventing SMT Assembly Defects and Product Failure”.

In 2018 the central topics of all German and English tutorials will be interconnection technology, reliability and quality of assemblies, micro systems technology, system integration and automation.

For the complete program and a list of all exhibitors please visit

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