SMT Hybrid Packaging 2018: Conference and tutorial registration now open

Registration for extensive program offered by the SMT Hybrid Packaging Conference 2018 is now open. Participants can benefit from attractive early bird prices via the homepage of the event at smthybridpackaging.com/conference.

Practical and solution-oriented transfer of knowledge

The conference and the tutorials taking place at SMT Hybrid Packaging will once again offer an application-oriented exchange and practical training opportunities in 2018. From 5 – 7 June 2018, an international audience of experts will come together in Nuremberg for three days to discuss cases along the entire value chain of electronic assembly production.

The conference focuses on two specialized topics. On 6 June 2018 all lectures will revolve around "3D Printing Technologies - Flexible Forming in Electronics Production" and on 7 June 2018 the topic "Module Reliability - Functionality and Application-Related" are to be covered in detail from different angles.

High-quality tutorials

The practical tutorials offered at the SMT Hybrid Packaging cover the entire value chain of electronic assembly production. In addition to the nine three-hour tutorials, four of which are in English, nine one-hour short tutorials, including three in English, participants are invited to learn and discuss. The main topics for 2018 include assembly and connection technology, module reliability, quality assurance, microsystem technology, system integration and automation.

Products and services live at the exhibition

At the parallel exhibition for system integration in microelectronics, exhibitors will be presenting their product implementations and services. The combination of conference and exhibition, taking place under one roof, is unique for this topic in Europe. A particular highlight is the "Future Packaging" production line on "Intelligent automation for e-mobility and robotics." As many of the space has already been reserved, interested companies are urged to register as soon as possible.

Conference participant savings with early bird rates

Until 23 April 2018, participants can benefit from attractive early bird prices. They can secure both cheaper tickets and a place in the desired presentation area in good time.

The complete conference program and further information on the tutorials are available at smthybridpackaging.com/conference.

Up-to-date event information is available at smthybridpackaging.com.