Dialog Semiconductor announced the first shipments of its SmartBond™ DA14585 Bluetooth low energy (BLE) System-on-Chip (SoC) to two internationally-recognized suppliers to the automotive industry for use in tire pressure monitoring system (TPMS) sensors. With over 100 million units of its SmartBond SoCs already shipped to other applications, this represents another success milestone for Dialog’s Bluetooth market leadership.
With a long legacy in the automotive market as a provider of motor control ICs, Dialog now addresses the TPMS market with the DA14585, the lowest cost, lowest power Bluetooth low energy SoC in high volume production today. To build a Bluetooth low energy-enabled TPMS, only sensors supporting pressure, temperature and acceleration and a battery need to be added. The DA14585 handles the entire processing required for the TPMS application, with no additional microcontroller needed. Further benefits include high security, upgradable firmware and connectivity to automobile computers via a single node for all Bluetooth low energy functions.