SMT Hybrid Packaging 2017 remains leading platform of electronic manufacturing

19.05. 2017 | News

After three intensive days, the organizer of SMT Hybrid Packaging – Mesago Messe Frankfurt GmbH – looks back on a successful exhibition with conference:

“The SMT Hybrid Packaging presented itself as a forward-looking fair with solution character. It is the only event in Europe that takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies. Visitors were able to get an excellent overview of the complete value added chain and conference attendees enlarged their knowledge,” explains Anthula Parashoudi, Vice President of Mesago Messe Frankfurt GmbH.

Positive response from exhibitors

Several exhibitors summarized their participation directly after the exhibition. Among other things, the SMT Hybrid Packaging scored with its competent visitors, including decision makers from all over the world: “Yamaha is very pleased of its participation at SMT Hybrid Packaging 2017 as we gained new leads and had several indeep conversations with new potential,” says Oumayma Grad, Marketing Communications Manger of Yamaha Motor Europe N.V.

Information and knowledge transfer on a high level

About 15,000 visitors informed themselfes especially about latest trends and innovations and seized the chance to network within the industry. Moreover, the SMT Hybrid Packaging offered many practice-related and user-friendly possibilities of extended studies. Diverse forum presentations and tutorials as well as the conference running parallel to the exhibition were used to refresh know-how and get into conversation with experts.

The SMT Hybrid Packaging 2017 at a glance

Exhibition area: 26,200 sqm
32 represented companies
Visitors: about 15,000
Conference attendees: 259


A detailed analysis with further results of SMT Hybrid Packaging will be available by the end of June 2017. High-resolution photos of the show are available in printable quality in the press-section of

SMT Hybrid Packaging 2018 will take place from 5 to 7 June 2018 in Nuremberg, Germany.

Additional information is available at or directly from the organizer Mesago Messe Frankfurt GmbH at

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