SMT Hybrid Packaging 2017: Starting signal for conference and tutorial registration

22.02. 2017 | News

No need to wait any longer for all interested participants of the SMT Hybrid Packaging 2017 conference and tutorials: the registration for the highclass program in the field of electronic assembly production is now online available at

Knowledge transfer – practical and solution-oriented

User will benefit from expert knowledge ranging from the design sector to process technologies up to quality assurance. The speakers come from well-known companies such as Indium, Panasonic, Audi, and Osram. For the first time, short-tutorials will be held with a duration of one and a half hours besides the three hour presentations in conference and tutorials this year.

“The extensive conference program of SMT Hybrid Packaging 2017 provides practical and solution-oriented papers for every user in the field of electronic assembly production. Especially the short-tutorials will provide an overview of special topics and allow time for a comprehensive tour of the exhibition”, explains Anthula Parashoudi, Vice President Mesago Messe Frankfurt GmbH, organizer of SMT Hybrid Packaging.

Securing early booking discount

Early bird rates are available until 3 April 2017. Beside the conference, participants can learn the latest technologies and meet new contacts in the exhibition halls.

The complete conference program and further information about the tutorials can be found online at


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