SMT Hybrid Packaging 2017: Positive intermediate result – number of exhibitor on last year´s level

14.02. 2017 | News

Three months previous to the start of SMT Hybrid Packaging 2017, the number of exhibitor applications is on last year´s level. The international exhibition and conference is the ideal presentation platform for exhibitors in the topic area system integration in microelectronics.

Pete Molenaar, Marketing Manager of TOWA Europe B.V. PDC and longtime exhibitor is convinced of the participation in 2017 again: “TOWA Europe B.V. PDC has been present at SMT Hybrid Packaging for the past six years and it has been very much worthwhile, because it has been an excellent opportunity to meet with customers, to make new contacts and obtain new leads.” The feedback received from exhibitors illustrates the event’s central importance for the industry.

Newcomer Pavilion nearly fully booked

Also promising is the new joint stand for companies which weren´t listed as an exhibitor at SMT Hybrid Packaging in the last five years. It is called Newcomer Pavilion. This offer enables companies to test the exhibition with low organizational efforts and special conditions. This offer is well accepted and the Newcomer Pavilion is nearly fully booked. However, interested companies can still register for one of the last stand spaces.

State-aided participation for German start-ups

As a special highlight there will be a joint stand for young and innovative companies from Germany. This is organized in cooperation with the German Federal Ministry of Economic Affairs and Energy. German companies can be aided with 60 percent of the costs by the state. They  have to be younger than ten years, less than 50 employees and less than ten million EUR annual turnover.

SMT Hybrid Packaging – more than just an exhibition

The SMT Hybrid Packaging is not only a trade fair but a holistic communication platform. This means extensive possibilities for exhibitors to be in focus in excess of the regular booth. With several sponsoring measures exhibitors can increase their visibility at the trade fair, for example on site, in the exhibition guide, in the new event app and with presentations on both forums.

The SMT Hybrid Packaging 2017 also give exhibitors the chance to care for their customers individually and in a targeted manner onsite. They can name VIPs and give them special benefits at the exhibition – for example a parking space close by the entrance or the relaxing flair of the VIP lounge.

Still stand spaces available

With its extensive possibilities and offers, the SMT Hybrid Packaging is the perfect platform for companies from the topic area of assembly and interconnection technologies. Whether the presence on one of the high class joint stands or the individual participation – at SMT Hybrid Packaging every company can exhibit in a representative way.

Application documents and further information can be found on


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