News

CHINAPLAS 2019 closed its highly successful, four-day run in Guangzhou on May 24. The annual show –– held this year at the China Import & Export Fair Complex, Pazhou, in Southern China –– attracted 3,622 exhibitors and...

Infineon Technologies is presenting the fourth generation of its REAL3™ image sensor IRS2771C. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular,...

Dialog Semiconductor announced the DA740x, a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation (ANC), providing optimal audio performance in any environment to the rapidly-growing wireless...

Flir Systems announced the TrafiData intelligent thermal traffic sensor solution for improved data collection capabilities to offer transportation management with key insights for smarter, safer cities. Flir TrafiData is a unique offering in the...

NXP Semiconductors announced the first RF power transistor designed for RF energy using Gallium Nitride on Silicon-Carbide (GaN-on-SiC). Leveraging the high efficiency of GaN, the MRF24G300HS exceeds the efficiency of most magnetrons at 2.45 GHz,...

Diodes Incorporated announced a new addition to its family of low voltage level translators, offering simple and autonomous bidirectional operation. The PI4GTL2002 is a 2-bit level shifter designed to translate signals conditioned for one voltage...

Tektronix introduced two new products to its portfolio with the launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal Oscilloscope (MSO). Built on the award-winning user experience first introduced in the 5 and 6 Series...

SMTconnect, formerly known as SMT Hybrid Packaging, is the only event in Europe that brings together people and technologies from the areas of development, production, services, and applications in connection with electronic assemblies and...

Sensirion is announcing the SCD40 – the first miniaturized CO2 and RH/T sensor that fits in a space of just one cubic centimeter. This disruptive innovation is based on the photoacoustic sensing principle and combines minimal size with...

‘Beyond 3D printing’ is the theme of this year’s purmundus challenge, the ideas competition for imaginative, aesthetic and trend-setting product ideas and innovative projects. Once again in 2019, the competition will serve as the...