January 25, 2022 
Professional magazine and portal dedicated to electronics 
At the SMT Hybrid Packaging visitors experience the diversity of assembly and interconnection technologies in a new setting at the well-established exhibition site in Nuremberg this year: The International Exhibition and Conference for System...
New milestone: more than 1,000 exhibitors for the first time Over 30,000* high-calibre trade visitors once again Growth in conference delegate numbers 2017 embedded award recognises pioneering innovations Following its 15th round,...
The IDTechEx Show! will be held on 10 & 11 May at the Estrel Convention Center and will showcase the latest technology needs and advancements to over 3,000 attendees. This event will cover flexible and hybrid electronics; wearable...
AMPER is the most significant trade fair of electrical engineering and electronics in Central Europe. It's a great opportunity for advertising and promotion, for example, in the March issue of our magazine, a printed version of which we, as...
The eyes of the embedded community were firmly fixed on Nuremberg on 14 March 2017, the first day of the embedded world Exhibition & Conference, as the traditional embedded AWARDS ceremony took place. Handed out for the thirteenth time, this...
The leading IoT conference series is returning to Berlin on the 1-2nd June, with keynote speakers from the likes of Nestlé, BMW, Coca-Cola, GSK, Microsoft, Johnson Controls, Sigfox, Hamburg Sud, Piaggio, Turkish Airlines, Volvo, Reliance,...
From March 28 to 30, 2017, the printed electronics industry will be coming together at the Messe München trade fair center in Germany for LOPEC. Just a few weeks before the event begins, the exhibition space at the ICM – Internationales...
Autonomous driving will be one of the major trends in the years and decades to come. Camera-based safety systems will pave the way for self-driving cars and many other innovations. Many opportunities created by these embedded vision systems can...
Win a Microchip BM64 Bluetooth Audio Evaluation Board (BM-64-EVB-C2) from DPS. This board enables easy development with Microchip’s new IS206X of SoC devices and modules which offer Bluetooth Low Energy (BLE) capability. Uniquely...
No need to wait any longer for all interested participants of the SMT Hybrid Packaging 2017 conference and tutorials: the registration for the highclass program in the field of electronic assembly production is now online available at...
In just a few weeks, the wait will be over. From March 28 to 30, 2017, LOPEC, the International Exhibition and Conference for the Printed Electronics Industry, will be taking place at the ICM—Internationales Congress Center München in...
With the economic diversification plans in place, key government authorities across kingdom are emphasizing on providing the best quality of life for their citizens, which means seamless transportation, state-of-the-art healthcare facilities,...
