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Win a Microchip BM64 Bluetooth Audio Evaluation Board

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Win a Microchip BM64 Bluetooth Audio Evaluation Board (BM-64-EVB-C2) from DPS. This board enables easy development with Microchip’s new IS206X of SoC devices and modules which offer Bluetooth Low Energy (BLE) capability.  Uniquely...

04.03. 2017 | News

SMT Hybrid Packaging 2017: Starting signal for conference and tutorial registration

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No need to wait any longer for all interested participants of the SMT Hybrid Packaging 2017 conference and tutorials: the registration for the highclass program in the field of electronic assembly production is now online available at...

22.02. 2017 | News

Intelligent packaging, flexible solar cells and more

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In just a few weeks, the wait will be over. From March 28 to 30, 2017, LOPEC, the International Exhibition and Conference for the Printed Electronics Industry, will be taking place at the ICM—Internationales Congress Center München in...

17.02. 2017 | News

UNDER THE PATRONAGE OF THE MINISTRY OF MUNICIPAL AND RURAL AFFAIRS (MOMRA), DAR AL RIYADH AND NISPANA JOINTLY ANNOUNCE THE FIRST SAUDI SMART CITIES CONFERENCE 2017

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With the economic diversification plans in place, key government authorities across kingdom are emphasizing on providing the best quality of life for their citizens, which means seamless transportation, state-of-the-art healthcare facilities,...

16.02. 2017 | News

SMT Hybrid Packaging 2017: Positive intermediate result – number of exhibitor on last year´s level

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Three months previous to the start of SMT Hybrid Packaging 2017, the number of exhibitor applications is on last year´s level. The international exhibition and conference is the ideal presentation platform for exhibitors in the topic area...

14.02. 2017 | News

The Internet of Uncanny Things

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To learn from genuine industry experts and make contact with the biggest and most important companies from the embedded sector – these are the goals of the more than 1,000 students from throughout Europe who are expected to attend the...

07.02. 2017 | News

Conductive inks in 2017: The next big things

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The conductive ink industry is still in search of the next big thing. Adverse competitive pressures in core volume markets has led most suppliers to seek new nascent opportunities. The prevalent strategy is now to have as broad a product portfolio...

06.02. 2017 | News

Preparations in full swing for embedded world 2017

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Knowledge transfer of the highest calibre Innovative new products and the latest industry trends Online registration – get your e-ticket today! Arrange appointments with exhibitors From 14 to 16 March 2017, the international...

30.01. 2017 | News

Embedded world 2017 already breaking records

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Embedded world 2017 already breaking records Exhibitor record in sight Exhibition space already exceeds last year's total Special display areas almost fully booked The success story of the embedded world exhibition &...

23.01. 2017 | News

LOPEC 2017: Printed electronics for the car of tomorrow

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LOPEC will be taking place in Munich, Germany from March 28–30, 2017, providing information on the latest products, technologies, and trends in printed electronics. This year, the automotive industry will be one of the focal points of the...

18.01. 2017 | News

Practical answers to the key issues facing the embedded industry

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Practical answers to the key issues facing the embedded industry The 15-year success story of embedded world High-calibre congress programme now online Embedded World Conference set to cover wide range of topics Electronic Displays...

18.01. 2017 | News

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