Teledyne LeCroy introduced its WavePulser 40iX high-speed interconnect analyzer, a uniquely capable solution for complete interconnect testing and validation. The WavePulser 40iX is the ideal single tool for high-speed hardware designers and test...
The SMTconnect strives to be a meeting place for all the areas involved in microelectronic production, including electronic manufacturing services (EMS). The statistics of the previous event, which took place in Nuremberg from 7 - 9 May 2019,...
The rapidly growing market of high precision applications requires Analog-to-Digital Converters (ADCs) with faster programmable data rates, higher accuracy and more integrated features to maximize system performance. To meet these needs, Microchip...
The PCB is one of the most important inventions of the last century. As a backbone of almost every electronic device, it creates the prerequisites for cutting-edge technology and also for mass-produced electronics. Consequently, the PCB & EMS...
A total of 81 exhibitors presented the latest trends, developments and product innovations for all application areas of power electronics in Asia from 26 - 28 June 2019. With a total area of 7,000 square meters in Shanghai, PCIM Asia closed its...
The STMicroelectronics L5965 seven-output automotive power-management IC (PMIC) enables more compact and reliable electronic control units for automotive-vision systems and other in-vehicle applications, leveraging direct operation from battery...
Keysight Technologies announced the next generation of the company's multi-purpose, handheld microwave analyzer, the FieldFox B-series, which delivers measurement precision and bandwidth up to 100 MHz for wide-band, real-time spectrum analysis...
Organizers celebrate highly successful ninth edition of the trade fair for automation and smart, digital and flexible manufacturing. Following the expansion both in the number of exhibitors and in the floorage of the exhibition area in Parma,...
CHINAPLAS 2019 closed its highly successful, four-day run in Guangzhou on May 24. The annual show –– held this year at the China Import & Export Fair Complex, Pazhou, in Southern China –– attracted 3,622 exhibitors and...
Infineon Technologies is presenting the fourth generation of its REAL3™ image sensor IRS2771C. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular,...