April 22, 2025 
Professional magazine and portal dedicated to electronics 
IPC’s draft version of IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing, is now open for public review. The draft standard has been progressing through the standards process since fall of 2021 and, despite some minor delays...
SiPearl, the company designing the high-performance, low-power microprocessor for European exascale supercomputers, has entered into a strategic collaboration agreement with NVIDIA for joint technical and business developments aiming to combine...
IoT network developers are looking for an easy path to implement a secure cellular connection in their design applications but are faced with design complexities and high deployment costs. To offer a solution for network designers who need the...
Vehicle electrification is increasing – and correspondingly the extent of touch panel usage for the operation of automotive cockpit applications. Screen sizes have grown excessively – either as pillar to pillar architecture or as seamlessly...
Analog Devices announced the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems. Enabling cameras and sensors to perceive 3D space in one megapixel resolution,...
Farnell, an Avnet company and global distributor of electronic components, products and solutions, is now shipping the new Tektronix 2 Series Mixed Signal Oscilloscope (2 Series MSO). This next-generation instrument is a major advancement in test...
onsemi, a leader in intelligent power and sensing technologies, today announced the introduction of two complete system solutions supporting the most widely used building automation network protocols - Power over Ethernet (PoE) and KNX. Easing...
Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced that AEWIN Technologies, Taiwan, is offering its platform of Multi-Access Edge Computing network appliances, SCB-1932, with the Blaize®...
Renesas Electronics Corporation announced the SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions―the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution...
Once again embedded world impressively proved that it is the leading trade fair of the international embedded community. More than 720 exhibitors from 39 countries presented their latest developments in embedded technologies, from components,...
