News

Microchip Technology Inc. announced a new Internet of Things (IoT) rapid development board as part of an expanded partnership with Google Cloud, enabling designers to prototype connected devices within minutes. The solution combines a powerful...

Power Integrations announced the release of LinkSwitch™-XT2 offline switcher ICs incorporating 900 V power MOSFETs. Targeting high-efficiency isolated and non-isolated flyback power supplies up to 8 W, the up-rated ICs are suitable for...

Teledyne LeCroy announced the availability of its Teledyne Test Tools (T3)-branded portfolio of test equipment through High-Service Distributor (HSD) partners. The T3 portfolio offers turnkey and affordable ancillary test equipment that engineers,...

More than 3,100 exhibitors from over 50 countries provided an insight into the electronics of the future with their solutions and products at the Munich trade fair site from November 13 to 16, 2018. The focal topics of this year’s electronica...

Sensirion now offers a new humidity and temperature module, the SCC30-DB. Some applications require a humidity and temperature sensor to be located in a specific part of the device – often at a different location to the main control board....

IQRF Summit 2019 When: April 9th to 10th, 2019 Where: Clarion Congress Hotel Prague WWW: www.iqrfsummit.org We invite you to the fourth annual conference about the Internet of Things with the IQRF® wireless technology. During the last...

GW Instek launches GDM-906X series 6 ½ digit dual measurement multimeter (2 models: GDM-9061 and GDM-9060), featuring high precision DC voltage accuracy, fast sampling rate, 12 measurement functions (DC voltage/current, AC voltage/current,...

Vishay Intertechnology, Inc. introduced four new 100 V and 120 V TMBS® Trench MOS Barrier Schottky rectifiers that provide up to 20 mV lower forward voltage than previous-generation devices. The Vishay General Semiconductors V30100CI,...

The embedded world is making developing brilliantly. The prospects are also excellent for the embedded world Conference and the electronic displays Conference, the programmes of which are already available online. The motto for this year’s...

Renesas Electronics Corporation announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018....