WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging (WLP/PLP).
Indium Corporation offers a robust portfolio of flux products designed for new or emerging industry challenges. To learn more about Indium Corporation’s fluxes, visit www.indium.com/ball-attach.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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