Live webinars

The future of 3D printing in medicine and dentistry

IDTechEx

In this webinar, the Analysts will present an:

  • Introduction to 3D printing adoption drivers and restraints
  • Overview of key applications, materials and use cases for 3D printing in dentistry
  • Insight into key processes, applications and use cases for 3D printing and 3D bioprinting in tissue engineering

Datum: 16. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (50 minut)
Date: October 16, 2018 - 3:00am | 11:00am | 6:00pm CEST (50 minutes)

 

Second-life Electric Vehicle Batteries

IDTechEx

This webinar will provide:

  • An introduction to second-life electric vehicle batteries
  • Forecast on the second-life battery availability
  • Potential markets for second-life batteries
  • Examples of announced industrial implementations of second-life batteries
  • Value chain of second-life batteries
  • A discussion on the business models of second-life batteries

Datum: 18. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (30 minut)
Date: October 18, 2018 - 3:00am | 11:00am | 6:00pm CEST (30 minutes)

 

Reliability Modeling and Simulation of Commercial-Off-The-Shelf (COTS) Assemblies Using Sherlock

DfR Solutions

The reliability risks associated with commercial-off-the-shelf (COTS) electronics and printed circuit board assemblies (PCBAs) can be challenging to evaluate. The integration of COTS PCBAs into larger systems often results from the need to reduce cost and design timelines. In these cases, there is frequently minimal design information available from the manufacturer. Additionally, COTS assemblies are increasingly utilized in non-commercial environments (i.e. military, aerospace). Dedicated resources and significant testing time can be required to assess these assemblies. This webinar will provide a live demonstration of how a COTS PCBA can be assessed using Sherlock Automated Design Analysis™ software, given only a physical sample and no design information. This approach is a cost-effective way to assess board-level reliability and better understand a PCBA’s response to environmental conditions.

Datum: 18. 10. 2018 - 17:00 SELČ
Date: October 18, 2018 - 11 am EDT | 17:00 CEST

 

Multifunctionality is the key next step for polymer composites

IDTechEx

This webinar will include:

  • Technical analysis of different types and drivers of different embedded functionality
  • The underlying chemical and material innovations advancing this field
  • The main players, challenges, and technology readiness level

Datum: 23. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (40 minut)
Date: October 23, 2018 - 3:00am | 11:00am | 6:00pm CEST (40 minutes)

 

From Bluetooth Low Energy 4.2 to 5.0 - Adaptions, advantages and misunderstandings

Würth Elektronik

With the BLE 5.0 standard new features come into life. This webinar will give a rough overview what the new features mean for the user and how SIG listing can be achieved with pre-certified radio modules.

Datum: 24. 10. 2018 - 15:00 SELČ (60 minut)
Date: October 24, 2018 from 3:00 PM CEST (60 minutes)

 

DxDatabook - Ask the Experts

Mentor, a Siemens Business

Not sure what is required to setup Databook? Wondering how to perform a multi-criterion search for your parts? Need to add missing properties to components on your schematic?  Join our panel of experts on October 24th to get your Databook questions answered.

Databook provides part search and verify capabilities when creating your schematics. It utilizes parametric part data stored in an ODBC-compliant Database Management System database and merges that with the CAD Library schematic symbols. Databook offers parametric search functionality that allows you to easily find the appropriate parts and place them in your design. The verify capability ensures the parts used in your schematic are approved and correct with respect to your parts library. This facilitates smoother transitions to downstream processes such as purchasing.

Datum: 24.10. 2018 18:00 SELČ (30 minut)
Date: October 24, 9:00 AM US/Pacific (30 minutes)

What’s New in Simcenter Flomaster Software V9.1

Mentor, a Siemens Business

Simcenter Flomaster V9.1 focuses on increasing user productivity and extending simulation applicability.  A number of enhancements are introduced in the user interface and in the Launchpad to help to increase user productivity.  In particular, warning and error messages are made more clear and powerful and a black-box component is introduced to protect sensitive data and intellectual property.

Datum: 25. 10. 2018 - 12:00 SELČ | 19:00 SELČ (45 minutes)
Date: 25th October 2018 - 11am UK & 10am PST (45 minutes)

 

The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature

DfR Solutions

With the larger size of Ball Grid Array (BGA) solder joints, the available volume for underfilling is significantly increased. Although the size of the solder joints and package dimension governs the volume of underfill material, the larger 2nd level solder interconnects are more susceptible to thermal fatigue with certain underfills and thermal profiles.

In this webinar we will discuss a study of BGA packages that were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products. We will review the factors associated with reduced fatigue endurance of certain underfill materials under temperature profiles with mean temperature conditions and contribute to the development of new criteria of underfill material selection for 2nd level interconnects.

Datum: 25. 10. 2018 - 17:00 SELČ
Date: October 25, 2018 - 11 am EDT | 17:00 CEST

 

3D Library Management - Netlist vs Integrated Flow

Mentor, a Siemens Business

PADS 3D gives designers the power to visualize their PCB design in 3D.  Importing models for components allows for more accurate 3D collision checking. This webinar will show the correct methodology for importing mechanical models, saving them to your library, and using these models in future designs.

Datum: 8. 11. 2018 17:30 SELČ
Date: November 8, 2018, 8:30 AM US/Pacific

 

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