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DPS 1/2017

Embedded Vision

Data protection

CAD-MCAD conversion

Osmond PCB for Mac

TruView inspection

LEM sensors

MCUs in IoT

Thermal analysis

FriWalk assistant

AMS sensors

TDS101 display

News

Present your company at AMPER Trade Fair 2017

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AMPER is the most significant trade fair of electrical engineering and electronics in Central Europe. It's a great opportunity for advertising and promotion, for example, in the March issue of our magazine, a printed version of which we, as...

23.02. 2017 | News

SMT Hybrid Packaging 2017: Starting signal for conference and tutorial registration

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No need to wait any longer for all interested participants of the SMT Hybrid Packaging 2017 conference and tutorials: the registration for the highclass program in the field of electronic assembly production is now online available at...

22.02. 2017 | News

Intelligent packaging, flexible solar cells and more

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In just a few weeks, the wait will be over. From March 28 to 30, 2017, LOPEC, the International Exhibition and Conference for the Printed Electronics Industry, will be taking place at the ICM—Internationales Congress Center München in...

17.02. 2017 | News

UNDER THE PATRONAGE OF THE MINISTRY OF MUNICIPAL AND RURAL AFFAIRS (MOMRA), DAR AL RIYADH AND NISPANA JOINTLY ANNOUNCE THE FIRST SAUDI SMART CITIES CONFERENCE 2017

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With the economic diversification plans in place, key government authorities across kingdom are emphasizing on providing the best quality of life for their citizens, which means seamless transportation, state-of-the-art healthcare facilities,...

16.02. 2017 | News

SMT Hybrid Packaging 2017: Positive intermediate result – number of exhibitor on last year´s level

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Three months previous to the start of SMT Hybrid Packaging 2017, the number of exhibitor applications is on last year´s level. The international exhibition and conference is the ideal presentation platform for exhibitors in the topic area...

14.02. 2017 | News

The Internet of Uncanny Things

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To learn from genuine industry experts and make contact with the biggest and most important companies from the embedded sector – these are the goals of the more than 1,000 students from throughout Europe who are expected to attend the...

07.02. 2017 | News

 

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