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Next-generation multizone time-of-flight sensor from STMicroelectronics boosts ranging performance and power saving

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STMicroelectronics’ VL53L8CX, the latest-generation 8×8 multizone ToF ranging sensor, delivers a range of improvements including greater ambient-light immunity, lower power consumption, and enhanced optics. ST’s direct-ToF sensors combine a...

Yamaha Robotics: New YRM10, next-generation compact high-speed modular mounter

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52,000 CPH Economy Model Surface Mounter, World's Fastest in 1-Beam/1-Head class Yamaha Robotics announced that the new YRM10, a surface mounter that is the world's fastest in 1-Beam/1-Head class1 mounting performance of 52,000 CPH will be...

High-performance MCUs enable graphics and voice / vision multi-modal AI applications

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Renesas’ Arm® Cortex®-M85 processor-based devices offer ultra high performance, graphics capabilities and leading-edge security for building automation, smart home, consumer and medical applications Renesas Electronics Corporation, a premier...

Quantum technologies: Bosch aims to use sensors to take a leading position

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Areas of application from medicine to mobility: - Medicine: Bosch quantum sensors could help save lives in the future. - Mobility: Ultra-precise navigation in the air, on the road, and on water. - Miniaturization: Bosch is working to...

Würth Elektronik launches research project HyPerStripes

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In many miniaturized electronics applications, conventional cable wiring is both costly and material-intensive. It also limits the scope for innovation and product performance. The HyPerStripes (Hybrid integrated high performance electronic...

IOT Solutions World Congress will gather over 400 companies and 250 speakers

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Discover the ultimate tech-powered revolution at the IOT Solutions World Congress 2024 The IOT Solutions World Congress (IOTSWC), the leading international event on industry transformation through disruptive technologies, returns in 2024 to...

The new photonics bonder for sub-micron use in nano- and optoelectronics

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The German DIE Bonder specialist Tresky GmbH introduced its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement...

New 32-bit MCU features an embedded hardware security module to safeguard industrial and consumer applications

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 Highly configurable PIC32CZ CA devices are available with a 300 MHz Arm® Cortex®-M7 processor. Industrial and consumer application designers must consider implementing security functionality in their devices during the development process...

Ultra-low capacitance ESD diodes protect automotive data interfaces

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Robust protection devices minimize their impact on signal integrity Nexperia, the expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data...

Processor roadmap for next-gen automotive SoCs and MCUs

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Future Offerings to Include R-Car SoCs with Advanced In-Package Chiplet Integration Technology and Arm-Based Automotive MCUs Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, laid out plans for its...