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Analysis SMT Hybrid Packaging 2017: Impressive satisfaction of exhibitors and visitors


As a solution orientated exhibition with conference, the SMT Hybrid Packaging lured many visitors and exhibitors from all over the world to the Nuremberg exhibition center from 16 – 18 May 2017. At three intensive event days, experts of...

25.07. 2017 | News

Gain Extended Bluetooth Range with Cypress' EZ-BLE PRoC XR Modules


Mouser Electronics is now shipping EZ-BLE™ PRoC™ XR Bluetooth® 4.2 modules and evaluation boards from Cypress Semiconductor. These Bluetooth low energy wireless modules offer an extended range of up to 400 meters bidirectional...

24.07. 2017 | News

Smart Cities Expo World Forum


Smart Cities Expo World Forum combines the power of collocated conference with state-of-the-art expo floor in order to educate people towards smart cities and urban planning technologies, strive for innovation, promote business and connect...

21.07. 2017 | News

Microchip Extends eXtreme Low Power PIC32MM Microcontroller Family


New PIC32MM “GPM” microcontrollers are now available from Microchip. The eXtreme Low Power (XLP) devices feature large memory in small packages, providing ample battery life for space-constrained applications. With the inclusion of...

21.07. 2017 | News

Rigol Announces new Custom Chipset and Oscilloscope Architecture


Rigol Technologies continues its 19 year history of Test and Measurement innovation with the announcement of its new Phoenix Oscilloscope chipset and the Ultravision II oscilloscope architecture. There are three chips in the Phoenix chipset...

20.07. 2017 | News

Lattice Delivers New Machine Learning and Sensor-to-Cloud Security Solutions


Lattice Semiconductor announced the availability of new reference designs based on its iCE40 UltraPlus FPGA devices to address emerging market requirements and to enable an expedited product development cycle. Expanding one of the industry’s...

17.07. 2017 | News


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