Indium Corporation, SAFI-Tech Announce New Supercooled BiSn Solder Paste

Indium Corporation®, a global electronics materials manufacturer and SAFI-Tech, an Iowa-based startup that is creating no-heat and low-heat solder and metallic joining products, have announced the launch of a new supercooled BiSn solder paste using SAFI-Tech’s innovative solder platform.

Using SAFI-Tech’s platform, liquid metal is encapsulated in a proprietary soft shell, keeping the solder alloy in a sub-cooled (liquid) state far below its normal melting/freezing point. The shell of these powder-like microcapsules can be removed using a traditional flux and reflow process, or burst by compression.

SAFI-Tech’s supercooled BiSn solder paste can be fluxed and reflowed at 135°C, a temperature that is currently impossible to reach using conventional BiSn solder alloys.

Target applications include flexible hybrid electronics and heat-sensitive applications currently using conductive epoxies.

SAFI-Tech and Indium Corporation are currently sending their supercooled BiSn solder product to interested parties for testing. For business inquiries and for more information about SAFI-Tech’s no-heat and low-heat solder and metallic joining products, contact Andy Mackie at amackie@indium.com and Ian Tevis at ian@safi-tech.com.

For more information see the original Press Release