ST launches multi-connectivity development kit for indoor and outdoor asset tracking

The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes firmware to simplify development targeted applications such as livestock monitoring, fleet management, and logistics.

The kit helps users evaluate ST’s industry-first short- and long-range STM32 wireless System-on-Chip (SoC) devices. The STM32WL55JC sub-GHz SoC for long-range connectivity (LPWAN) implements the LoRaWAN protocol and provides LoRa, (G)FSK, (G)MSK, and BPSK modulations. The other wireless SoC is the STM32WB5MMG module for 2.4GHz Bluetooth® Low Energy and Zigbee® connectivity. Each device has an Arm® Cortex®-M4 core for application processing with a dedicated Cortex-M0+ to manage the radio.

The development kit also includes an ST25DV64K near-field communication (NFC) contactless chip for secure pairing and communication and an STSAFE-A110 secure element that ensures privacy and guards against hacking.

In addition, a Teseo-LIV3F miniature GNSS module provides accurate and reliable outdoor positioning. Numerous ST sensors are integrated for monitoring asset condition and environment. These include an STTS22H low-voltage, ultra-low-power temperature sensor with ±0.5°C accuracy, HTS221 digital humidity and temperature sensor; LPS22HH barometric pressure sensor, and LIS2DTW12 ultra-low-power 3-axis accelerometer. There is also an LSM6DSO32X always-on inertial module, which contains a3D accelerometer and 3D gyroscope with machine-learning core (more info).